ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
In this paper a novel approach to the design and fabrication of a high temperature inverter modulefor hybrid electrical vehicles is presented. Firstly, SiC power electronic devices are considered in place of theconventional Si devices. Use of SiC raises the maximum practical operating junction temperature to well over200◦C, giving much greater thermal headroom between the chips and the coolant. In the first fabrication, aSiC Schottky barrier diode (SBD) replaces the Si pin diode and is paired with a Si-IGBT. Secondly, doublesidedcooling is employed, in which the semiconductor chips are sandwiched between two substrate tiles. Thetiles provide electrical connections to the top and the bottom of the chips, thus replacing the conventional wirebonded interconnect. Each tile assembly supports two IGBTs and two SBDs in a half-bridge configuration. Bothsides of the assembly are cooled directly using a high-performance liquid impingement system. Specific featuresof the design ensure that thermo-mechanical stresses are controlled so as to achieve long thermal cyclinglife. A prototype 10 kW inverter module is described incorporating three half-bridge sandwich assemblies, gatedrives, dc-link capacitance and two heat-exchangers. This achieves a volumetric power density of 30W/cm3
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/17/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.556-557.709.pdf
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