Publication Date:
2019-07-13
Description:
Our goal is to develop a method for the automated attachment of large numbers of absorber tiles to large format detector arrays. This development includes the fabrication of high quality, closely spaced HgTe absorber tiles that are properly positioned for pick-and-place by our FC150 flip chip bonder. The FC150 also transfers the appropriate minute amount of epoxy to the detectors for permanent attachment of the absorbers. The success of this development will replace an arduous, risky and highly manual task with a reliable, high-precision automated process.
Keywords:
Spacecraft Instrumentation and Astrionics
Type:
12th International Workshop on Low Temperature Detectors; Jul 22, 2007 - Jul 27, 2007; Paris; France
Format:
application/pdf
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