ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
A series of polishing experiments have been carried out using Mn2O3 as abrasive grains toexamine the polishing characteristics of CMP for oxygen-free copper. It has been found that thepolishing rate increases as the polishing speed and/or polishing pressure increases, also the role ofpolishing speed on the polishing rate is more significant than that of the polishing pressure. Theeffects of the polishing conditions are however small, when polishing a finished surface roughness ofabout Ra 5 nm. A long polishing time, with an approximately constant polishing rate, can beachieved, without dressing, with a polishing pressure P = 9.4 kPa. It was found that higher polishingpressures could achieve a higher polishing rate, however the polishing pressure would decrease as thepolishing time increased
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/57/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.389-390.515.pdf
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