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  • 1
    Electronic Resource
    Electronic Resource
    DC Potential-Drop Technique for the Evaluation of 3-D Back-Wall Cracks in Steel Structures (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 321-323 (Oct. 2006), p. 434-440 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: A direct-current potential-drop NDE technique has been developed for the evaluation of a3-D back-wall crack in thick-walled structures. The measuring system contains two pairs of probes– one for current supply and the other for the measurement of potential-drop, where the currentsupplyand measuring probes are in close proximity to each other. The optimum arrangement of thefour-point-probes system is determined from the finite-element simulation of the three-dimensionalelectric crack problem. The predicted potential-drop across the crack has been verifiedexperimentally using the newly developed measuring sensor. Measured results of semi-ellipticalcracks in stainless steel plates establish the practicality as well as reliability of the present potentialdropmethod of testing for the evaluation of 3-D back-wall cracks in thick-walled structures
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/51/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.321-323.434.pdf
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  • 2
    Electronic Resource
    Electronic Resource
    Sensitive Ultrasonic NDE of Tightly Closed Small Cracks in Carbon Steel Structures (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 321-323 (Oct. 2006), p. 644-648 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Nondestructive evaluation of tightly closed small cracks in carbon steel has beeninvestigated under no load conditions. The investigation has been carried out by using a newultrasonic method of testing, which has the capability of dealing with smaller tight crackssensitively. Tight closure of small fatigue cracks in carbon steel plates is realized when themeasured responses are compared with the calculated responses of the identical open cracks. Highlysensitive characteristic of the present method is verified through the comparison of the results withthose obtained by the standard ultrasonic method of testing
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/51/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.321-323.644.pdf
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  • 3
    Electronic Resource
    Electronic Resource
    Effects of Methane Concentration in the Deposition Process on the Crystal Structure and the Adhesive Fracture Toughness of CVD Diamond (2002)
    Westerville, Ohio : American Ceramics Society
    Journal of the American Ceramic Society 85 (2002), S. 0 
    Details
    ISSN: 1551-2916
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Crystal structures of CVD diamond particles were observed in detail by transmission electron microscopy. The particles were deposited on silicon substrates under various conditions and had different levels of adhesion. An interlayer of SiC was found along the interface obtained with low methane concentration in the source gas, but it disappeared when deposited with higher methane concentrations. On the other hand, the size of crystal grains became smaller with increasing methane concentrations. From the correspondence between the structures and the adhesive toughness of these particles, it was suggested that the effect of both the SiC interlayer and the variation of grain size resulted in the complicated trend of adhesion with respect to methane concentration.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1111/j.1151-2916.2002.tb00063.x
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  • 4
    Electronic Resource
    Electronic Resource
    Residual stress distribution in the direction of the film normal in thin diamond films (1999)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 86 (1999), S. 224-229 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The residual stress distribution in the direction of the film normal in thin diamond films deposited on Si substrate has been evaluated together with the distribution of Young's modulus. The films were deposited on the substrate by the microwave chemical vapor deposition method. It has been observed that the curvature of the diamond films delaminated from the Si substrate is functionally dependent on the film thickness. Young's modulus, which has been estimated by the film bending test in conjunction with a finite element method of analysis, appears to be gradually decreasing towards the adhesion interface. On the basis of detailed measurement of curvature and with the aid of Raman spectroscopy, the residual strain distribution in the film has been evaluated. Although the average intrinsic stress was tensile as reported earlier, we have found that a huge compression concentrates in the very small region near the adhesion interface. This finding shows evidence that something happens on the interface, which is absolutely different from the subsequent process of film growth. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.370720
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  • 5
    Electronic Resource
    Electronic Resource
    Fracture toughness estimation of thin chemical vapor deposition diamond films based on the spontaneous fracture behavior on quartz glass substrates (1997)
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 82 (1997), S. 6056-6061 
    Details
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: This article is on the experimental estimation of the fracture toughness of thin diamond film deposited by the microwave plasma chemical vapor deposition method on a quartz glass substrate. Because of their differences in the coefficient of thermal expansion, diamond films on a quartz glass substrate suffer tensile stress at room temperature and show various kinds of spontaneous fracture behavior, reflecting the mechanical properties of the films. On the basis of detailed observation of cracking patterns and also measuring the residual stress with the aid of Raman spectroscopy, the fracture toughness of the film having thickness of around 1 μm has been estimated here satisfactorily without the help of any difficult microscopic experiment. The fracture toughness of the film of thickness 0.35 μm is found to be around half of that obtained with much thicker films. © 1997 American Institute of Physics.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1063/1.366473
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  • 6
    Electronic Resource
    Electronic Resource
    A Method for Quantitative Evaluation of Electrical Conductivity of Silicon Wafers by Millimeter-Waves (2004)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 270-273 (Aug. 2004), p. 41-45 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/48/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.270-273.41.pdf
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  • 7
    Electronic Resource
    Electronic Resource
    Verification of Prediction Method for Electromigration Failure Using Angled Polycrystalline Line (2005)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 297-300 (Nov. 2005), p. 263-268 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Electromigration is one of the main damage mechanisms of interconnecting metal lines. Recently, a governing parameter for electromigration damage in passivated polycrystalline lines, AFD* gen, was formulated, and a prediction method for electromigration failure in passivated polycrystalline line was developed using AFD*gen. This method requires only the film characteristics of the metal line and the application is not limited by a line shape and operating condition. The usefulness of the method has been shown using the straight-shaped lines. Using the ymmetrically and asymmetrically angled lines experiments are performed, and the line-shape dependency of the lifetime obtained by the prediction method is verified comparing with the results obtained from the experiment
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/50/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.297-300.263.pdf
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  • 8
    Electronic Resource
    Electronic Resource
    Diagram of Electromigration Pattern in Eutectic Pb-Sn and Pb-Free Solders (2005)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 297-300 (Nov. 2005), p. 837-843 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Solder is the most frequently used alloy, which serves as the bonding metal for electronics components. Recently, the interconnected bump is distinctly downsizing its bulk along with the integration of high-density packaging. The evaluation of electromigration damage for solder bumps is indispensable. Hence, it is fairly urgent to understand the mechanism of the electromigration damage to be capable of securing reliability of the solder bump and ultimately predicting its failure lifetime.Electromigration pattern in multi-phase material is determined by the combination of current density, temperature and current-applying time. In this paper, diagram of electromigration pattern (DEP) in solders is presented, where both of eutectic Pb-Sn and Pb-free solders are treated. DEP gives the basis for discussing and predicting the electromigration damage in solders
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/50/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.297-300.837.pdf
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  • 9
    Electronic Resource
    Electronic Resource
    Effect of Cavitation Number on the Improvement of Fatigue Strength of Carburized Steel Using Cavitation Shotless Peening (2004)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 261-263 (Apr. 2004), p. 1245-1250 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Peening can be used to produce a layer of compressive residual stress at the surface of components which are subject to fatigue or stress corrosion, thereby retarding crack initiation and/or impeding the development of new cracks and hence improving their fatigue life. We have developed a new peening method, Cavitation Shotless Peening (CSP), which makes use of cavitation impacts induced by the collapse of the cavitation bubbles to produce compressive residual stress and work hardening on the material surface. CSP is a surface enhancement technique which differs with shot peening in that shots are not used. CSP uses a submerged high-speed water jet with cavitation, herein referred to as a cavitating jet, whose intensity and occurring region can be controlled by parameters such as upstream pressure and nozzle size. Cavitation number , which is defined by the ratio of upstream pressure to downstream pressure, is the main parameter of the cavitating jet. In this paper, the pit distribution on the specimen was observed with cavitating numbers  = 0.0057 and  = 0.0142. The improvement of fatigue strength and introduction of residual stress were investigated for both conditions using carburized alloy steel (JIS SCM415). It was evident from a comparison between non-peened and cavitation shotless peened specimens that the cavitation number has influence on the fatigue strength of metallic materials. Comparison of shot peened and CSP specimens has also been discussed
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/47/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.261-263.1245.pdf
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  • 10
    Electronic Resource
    Electronic Resource
    On Microwave Dual Frequency Technique for Evaluation of Surface Cracks (2004)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 261-263 (Apr. 2004), p. 955-962 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: A method to estimate crack closure stress on the crack surface was introduced. The crack closure stress was estimated based on the compliance technique, while crack depth was measured by means of the microwave dual frequency technique. The effect of crack closure stress on detection and evaluation of a closed crack in a carbon steel by using the microwave dual frequency technique was discussed in details
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/47/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.261-263.955.pdf
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