ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The bond interface of a TLP (Transient Liquid Phase) bonded tin has been observedwith a TEM to investigate the effect of the liquid phase on the behavior of the superficial oxidefilm at the interface during the bonding process. In the solid-state-diffusion bonded jointwithout filler, abundant oxide inclusions were observed to be distributed within a region of afew 100 nm widths along the bond interface. In comparison with this, the liquid phaseintroduced by the eutectic reaction of the bismuth filler with the tin substrate decreased thewidth of the interfacial region involving abundant oxide inclusions to form a rather layerstructure a few 100 nm thick consisting mainly of SnO2. It also enhanced the annihilation of theuncontacted areas at the interface. The layer of the oxide became discontinuous and coalescedwith an increase in bonding temperature and pressure, and areas where no oxide inclusion couldbe observed at the interface were increased, when the liquid phase was formed. Owing to theseeffects, the bond strength rose at lower bonding temperatures and pressures when the bismuthfiller was applied
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/15/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.539-543.3503.pdf
Permalink