ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The effect of copper content on dynamic grain growth in Al-Cu-Zr system wasinvestigated by studying the microstructural development and texture evolution during uniaxialtensile deformation of Al-2wt%Cu-0.3wt.%Zr and Al-4wt%Cu-0.4wt.%Zr alloys at 450°C with astrain rate of 10-3s-1, with a similar initial microstructure in both materials. The initial microstructureconsisted of layers of different orientations, the layers being separated by high-angle grainboundaries with low-angle boundaries separating grains within the layers. The initial grain spacingwas about 5[removed info]m and the texture was typical of rolled aluminium alloys. The 4wt.%Cu alloy gave ahigher strain rate sensitivity index, m, and a greater ductility compared to the low copper contentalloy. An increase in grain size occurred in both materials due to deformation, but this dynamicgrain growth (DGG) was much greater in the material with the higher copper content. This wasassociated with a more rapid conversion of low-angle boundaries to high angle ones in the 4wt%Cumaterial which is consistent with changes in crystallographic texture occurring during deformation
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/17/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.558-559.803.pdf
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