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  • 1
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Inorganica Chimica Acta 45 (1980), S. L109 
    ISSN: 0020-1693
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Chemistry and Pharmacology
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Inorganica Chimica Acta 43 (1980), S. 59-63 
    ISSN: 0020-1693
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Chemistry and Pharmacology
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Computer Physics Communications 57 (1989), S. 401-406 
    ISSN: 0010-4655
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Computer Science , Physics
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 64 (1988), S. 607-609 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The range distributions of 10–120 keV 11B+ in polycrystalline Co, Ti, CoSi2, and TiSi2 targets have been measured by secondary ion mass spectrometry. The obtained projected ranges Rp and projected range stragglings ΔRp are within 25% and 10%, respectively, of those predicted using the Monte Carlo computer program trim. By comparison the one-dimensional Boltzmann transport calculation in suprem-3 tends to overestimate Rp by as much as 300% at the highest ion energies.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 3718-3725 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The removal of native silicon oxide on 〈100(approximately-greater-than) silicon with an electron cyclotron resonance (ECR) excited NF3 plasma is demonstrated. In situ x-ray photoemission spectroscopy verifies removal of the oxide and shows that a residue remains on the surface after exposure to the plasma. The residue is about 1.2 nm thick with the approximate formula Si6F8ON2 when analyzed with a uniform overlayer model. X-ray photoemission spectra of the residue show fluorine and oxygen in at least two different bonding states and a unique nitrogen having a diamagnetic bond. Chemical bonding in the residue is ascribed to Fx-Si, Fx-Si-O, Si-O-Si, and N2-O-Si species, where x=1, 2, and 3. A distinct high-energy peak is identified in the quasicore level F 2s transition that is attributed to a small amount of interstitial fluorine having diffused into the silicon lattice. The residue is stable at room temperature in both vacuum and under hydrogen, but when exposed to room ambient, it and the substrate appear to oxidize accounting for a loss of both fluorine and nitrogen. Heating the residue to 640 °C in vacuum causes a significant loss of fluorine and nitrogen also. A possible mechanism accounting for the formation of the residue is proposed assuming that there is a difference in the decay time of the atomic species in the plasma. The ECR cleaning process is integrated into a sputtered TiN/Ti metallization sequence to show the effect of in situ chemical and physical plasma cleaning methods on the electrical contact properties of devices with submicron dimensions and high-aspect ratios. The specific contact resistance of Ti to n+-polycrystalline Si and to TiSi2/n+-, p+-〈100(approximately-greater-than) Si is found comparable to that achieved with an ECR excited Ar plasma cleaning where a surface residue is not produced.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 74 (1993), S. 5217-5224 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The effect of electron cyclotron resonance plasma cleaning (100)Si surfaces with low energy Ne, Ar, and Xe ions is studied by in situ x-ray photoelectron spectroscopy, high-resolution cross-sectional transmission electron microscopy, atomic force microscopy, and measurement of both the single-surface reflectance and the modulated optical reflectance. Photoemission spectra show that complete removal of all surface contaminants with oxygen atoms knocked-in from the original native Si oxide and noble gas atoms implanted into the Si substrate are a common characteristic of this plasma cleaning process. The oxygen concentration appears to decrease with ion energy for all three ions, whereas the noble gas concentration is inversely proportional to the ion mass and essentially independent of the ion energy. This low energy ion bombardment sputters the surface causing only point defects with Ne ions, formation of a continuous thin amorphous overlayer with either Ar or Xe ions, and in addition, occasional subsurface planar defects with Xe ions alone. The original smoothness of the monocrystalline Si surface is maintained with Ne ions, while an increase in surface roughness accompanies the amorphization caused by Ar and Xe ions. The magnitude of the roughness, which depends more on the energy than on the mass of either ion is insufficiently small to account for a change in specularity at visible wavelengths. An increase in both the single-surface reflectance and the modulated optical reflectance is always observed after the plasma exposure and is shown to provide a sensitive measure of these changes in surface morphology with the latter technique being a somewhat more sensitive gauge of these effects.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 73 (1993), S. 4462-4467 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The electrical resistivity of reactively sputtered TiN films was measured as a function of film thickness. The effect of directionality of the sputtered atoms, substrate temperature, bias voltage, deposition rate, and film morphology on the electron conductivity in TiN films was studied. The combination of rapid deposition rate and high substrate temperature with bias-collimated sputtering results in TiN films with the lowest resistivity, 45 μΩ cm, the largest temperature coefficient of resistance, 1355 ppm, and the highest superconducting transition temperature, 5.04 K. These films are characterized by small grains with mixed 〈111(approximately-greater-than) and 〈200(approximately-greater-than) orientation and reduced electron scattering with an estimated electron mean-free path of 96 nm.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 5467-5470 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Aluminum oxide films were etched using low energy argon ions generated by a microwave electron cyclotron resonance (ECR) source argon plasma. The argon ion energies were controlled by biasing substrates placed on a 13.56 MHz capacitively coupled electrode. Reactively sputtered aluminum oxide films were used to study the relationship between the dc bias applied to these substrates and the etch rate of their films. In situ x-ray photoemission spectra of the Al 2p and O 1s transitions showed that the ECR plasma was effective in completely removing native aluminum oxide and adventitious hydrocarbon in 1 min at ion energies as low as 100 eV. This preclean technology did not change the dielectric breakdown distribution of antenna structures with 12-nm-thick gate oxide capacitors.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 71 (1992), S. 1001-1009 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Silicon surfaces are cleaned in an electron cyclotron resonance excited hydrogen plasma and characterized by in situ x-ray photoelectron spectroscopy and in situ static secondary ion-mass spectrometry. Emission spectroscopy and actinometry are used to characterize the hydrogen plasma. Exposure to the plasma for 3 to 4 minutes without applying heat or bias to the substrate completely removes the native silicon oxide resulting in a hydrogen terminated surface that is resistant to reoxidation. Adventitious hydrocarbon, when present on the surface, is also completely removed by the plasma. A shift in the isotope ratios of silicon suggests that a clean 〈100〉 silicon surface is monohydride terminated, whereas a 〈111〉 silicon surface appears largely dihydride terminated. A depth profile of the silicon isotope ratios shows a temporal instability, which with the assignment of a H 1s state in the valence-band spectra provides evidence that the hydrogen is concentrated at the surface and has not diffused deep into the silicon lattice. The oxygen removal rate has the following characteristics: two distinct microwave operating regimes separated by a discontinuity in power around 600 W; a singularity corresponding to rapid oxygen removal at 2.5 mTorr; an abrupt and near monotonic decrease in oxygen removal above 14 mTorr; and an invariance of the removal rate to ion-energy from about 10 to 100 eV. The density of hydrogen excited species and the ground state hydrogen atom density are correlated with the oxygen removal rate under all conditions except high pressure, where the density of hydrogen ions is low. This suggests an ion-induced etching mechanism whereby the native silicon oxide removal is enhanced with low-energy hydrogen ion bombardment.
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  • 10
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 71 (1992), S. 6079-6085 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: X-ray photoemission spectra of reactively sputtered TiN1.0 films are recorded without interference from adsorbed contaminants or ion sputter cleaning damage. In this way, the transition from hcp TiN0.3 to fcc TiN1.0 is characterized by a discontinuity in film stoichiometry, Ti 2p splitting energy, and Ti 2p3/2 binding energy as a function of the Ar/N2 ratio during sputtering. The line shapes of the N 1s and 2s transitions experience only an asymmetric broadening on forming fcc TiN. The core-level N 1s transition of fcc TiN is modeled as two components peaks with binding energies at 396.8 and 396.0 eV. Similarly, the valence band N 2s transition has corresponding component peaks at 16.8 and 16.2 eV. These high and low binding energy pairs are interpreted as on-site Ns and interstitial site Ni populations of nitrogen in a fcc TiN lattice, respectively. The ratio of N/Ti is 1.0 and the Ns/Ni ratio is approximately 6. Both ratios are independent of the composition of the sputtering gas mixture and the substrate temperature once fcc TiN is formed. The core level Ti 2p transition in fcc TiN is characteristic of a single Ti3+ oxidation state with a line shape that is also insensitive to the gas composition and the substrate temperature during sputtering.
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