ISSN:
0021-8995
Keywords:
Chemistry
;
Polymer and Materials Science
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
The subject of this paper is an infrared and liquid chromatographic characterization of epoxy molding compounds of importance in the microelectronic manufacturing industry. A complete infrared description of resin extracts from 4000 to 700 cm-1 is given for three nondisclosed commercial extracts via comparisons with model epoxy cresol novolac and phenol formaldehyde novolac resins and by observing those spectral alternations affected during cure. In addition, both the molecular weight distributions and the methodology of obtaining such for the resin and hardener components of the extracts are described. These results are based upon reversed phase liquid chromatography and infrared spectroscopic measurements. The analysis described in this paper demonstrates significant differences among materials that, by chromatography alone, appear to have only subtle variations in both the resin and hardener molecular weight distributions. These differences include not only the quantity of resin or hardener of a particular oligomeric molecular weight, but also the apparent resin-to-hardener stoichiometry of the combined system.
Additional Material:
11 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/app.1986.070310516
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