ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
In low temperature co-fired ceramic (LTCC) packaging which offers a good performanceto produce multilayer structures with electronic circuits and components, the via-hole fabrication ofLTCC ceramic-PET double layer sheets (green sheets or green tapes) by micro-scale punchingplays an important role in providing an electric path for the interconnection between layers.Although conventional punching has been used widely and many researchers have provided usefulinsights of the process, they are restricted to the punching of single layer material. This paperdiscusses the characteristic of micro via-hole punching of double layer sheets and the optimumprocess condition for via-holes of good quality. Workpiece (double layer sheet) used in the presentinvestigation consists of LTCC ceramic composite material layer (ceramic layer) of 20~100*m inthickness and PET layer of 38 and 75*m in thickness by tape-casting. The diameter of via-holesranges from 100~300*m
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/52/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.326-328.509.pdf
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