ISSN:
1662-8985
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
This paper investigated the wetting and adhesion property of undulated a-C:H surfaceswith surface morphology controlled for a reduced real area of contact. The nano-undulated a-C:Hfilms were prepared by radio frequency plasma enhanced chemical vapor deposition (r.f. PECVD)using nanoscale Cu dots surface on a Si (100) substrate. FE-SEM, AFM analysis showed that theafter repeat deposition and plasma induced damage with Ar ions, the surface was nanoscaleundulated. This phenomenon changed the surface morphology of a-C:H surface. Raman spectra offilm with changed morphology revealed that the plasma induced damage with Ar ions significantlysuppressed the graphitization of a-C:H structure. Also, it was observed that while the untreated flata-C:H surfaces had wetting angle starting ranged from 72° and adhesion force of 332.79 nN. Hadwetting angle the undulated a-C:H surfaces, which resemble the surface morphology of a cylindricalshape, increased up to 103.6° and adhesion force decreased down to 11 nN. The measurementsagree with Hertz and JKR models. The surface undulation was affected mainly by several factors:the surface morphology affinity to cylindrical shape, reduction of the real area of contact and airpockets trapped in cylindrical double asperities of the surface
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/41/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.47-50.948.pdf
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