ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
An assembly bed on thermosonic flip chip bonding was set up, two different structures oftool tips were designed, and a series of experiments on flip chip and bonding machine variableswere carried out. Lift-off characteristics of thermosonic flip chip were investigated by usingScanning Electron Microscope (JSM-6360LV), and vibration features of tool tips driven by highfrequency were tested by using PSV-400-M2 Laser Doppler Vibrometer. Results show that, forchip-press model, slippage and rotation phenomena between tool tip and chip have been solved byusing tool with greater area tip pattern during flip-chip bonding process, and welding failuresappeared in chip-collet model have been controlled. Greater area pattern on tool tip is better thansmall area pattern. The power of ‘n’ bumps on flip chip bonding is far smaller than that of n×(thepower of single wire bonding). The power is directly proportion to vibration displacement driven bythe power, high-power decrease positioning precision of flip chip bonding or result in slippage androtation phenomena. The proper machine variables ranges for thermosonic flip chip had beenobtained
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/53/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.339.257.pdf
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