ISSN:
1662-8985
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
This paper presents a concurrent multiscale study for the deformation mechanism of monocrystallinecopper under dynamic uniaxial tension. The multiscale simulation is based on the coupledmeshless and molecular dynamic (MD) method. Using it, the size of computational model can beextended to a large dimension (in micrometer) with an atomistic resolution. The pure MD simulationis difficult to reach this microscopic dimension because the number of atoms will be too large. In thisstudy, it has been revealed that the deformation behavior and mechanism of the copper is sensitive toits size, geometry, and loading strain rate. In addition, the Young’s modulus is found to be independentof the cross-sectional size and the strain rate range considered in this study. On the other hand, theyield stress decreases with specimen length and increases with the loading strain rate
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/40/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.32.241.pdf
Permalink