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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 5153-5157 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The incubation time for the crystallization of amorphous Ge (a-Ge) films was studied as a function of temperature between 150 and 500 °C by means of both in situ transmission electron microscopy and Raman scattering spectroscopy. The temperature dependence of the incubation time for free-sustained a-Ge films follows an Arrhenius curve with an overall (nucleation+growth) crystallization process activation energy of 2.0 eV. In the case where the a-Ge films were on Si3N4 substrates, an earlier stage of the crystallization was observed (nucleation), having an activation energy of 1.3 eV. In addition, it was found that a thin metallic layer of Al or Au, deposited on the a-Ge films, induces a very fast crystallization in the mode of dendritic growth, as reflected by a low activation energy (0.9 eV) for the incubation time temperature dependence.
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 73 (1993), S. 8309-8312 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A comparative study of the interfacial reactions between Pd and a-Ge:H, deposited at TS=150 °C (low temperature, LT) and at TS=200, 300 °C (high temperature, HT), was carried out by x-ray diffraction and Auger electron spectroscopy after sample annealing in the regime of T=200–300 °C and t=1/4–4 h. It was found that the Pd/a-Ge:H(LT) formed a much more stable Pd2Ge interfacial layer, compared to the Pd/a-Ge:H(HT) system in which the Pd2Ge was transformed to PdGe. The main difference between the LT- and the HT-a-Ge:H films is probably the structure of the material. Whereas the HT films are compact, the LT-a-Ge films contain a network of voids which slow down the diffusion of Ge to the interface.
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 71 (1992), S. 289-295 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Auger electron spectroscopy, x-ray diffraction, and transmission electron microscopy (TEM) have been used to study the kinetics and morphology of phase transformations in two-layer structures of Pd/a-Si deposited on silicon substrates. Different kinds of a-Si were used: undoped, hydrogenated-deuterated, and fluorinated (a-Si, a-Si:H:D, and a-Si:F, respectively). It was found that the as-deposited Pd/a-Si interface included an intermixed region with a composition close to Pd2Si, for all samples studied. This region widened during room temperature aging. Heat treatments in the temperature range of 200–400 °C resulted in the formation of an oriented, textured, palladium silicide (Pd2Si). The morphology of the Pd2Si region depended on the thicknesses of the Pd and a-Si films. Fractal-like colonies of the Pd2Si silicide formed in the nonsupported double layer films of Pd/a-Si:F during in situ heat treatment in TEM. The growth of these Pd2Si dendrites had 0.1–1 μm/s velocity and was a diffusion controlled process. Kinetic parameters of the silicidation process were obtained from the x-ray diffraction data. The growth of the crystalline Pd2Si layer in thick films was also found to be controlled by a diffusion limited process with an activation energy of 1.5 eV in all samples. The presence of F in a-Si promoted the formation of Pd2Si both in the room-temperature processes and following heat treatments.
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 84 (1998), S. 4343-4350 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Transport properties of crystallized amorphous Si1−xGex films, having different Ge content (x) and highly doped with boron were studied. The films were deposited by molecular beam at room temperature and subsequently annealed in vacuum at different temperatures between 500 and 900 °C for 1 h. The microstructure of the crystallized Si1−xGex films was characterized by means of transmission electron microscopy, x-ray diffraction, and scanning electron microscopy. Measured transport properties included Hall hole concentration (pH), Hall mobility (μH), electrical conductivity (σ), and the Seebeck coefficient (S), from which the "power factor" (S2σ) was evaluated. The results obtained for the Hall mobility of the Si1−xGex films are discussed on the basis of the carrier trapping model. The trapping state density at the grain boundaries increases with increasing B concentration, although it is not significantly dependent on Ge content. Consequently, the mobility energy barrier decreases with increasing B concentration and increasing Ge content. It was found that in all the studied Si1−xGex films, independent of x, the predominant scattering mechanism changes from acoustic phonon scattering to ionized impurity scattering with increasing the boron concentration from 5×1018 to 5×1020 cm−3. In addition, the Si1−xGex films demonstrate high electrical conductivity as well as a high Seebeck coefficient, after 1 h annealing at 600–800 °C, and thus exhibit a high "power factor" of the order of 6 μW/cm K2. Thus, these films have potential applications in thin-film thermoelectric devices. © 1998 American Institute of Physics.
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 75 (1994), S. 7875-7880 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The amorphous-to-crystalline (AC) transition of amorphous Si thin films containing fluorine or hydrogen is studied by transmission electron microscopy. The AC transition can be described quantitatively by the incubation time prior to the onset of crystallization t0. This parameter is found to decrease exponentially with temperature with an activation energy of 1.7 eV for a-Si:F and 3.1 eV for a-Si:H:D. It is found that during the crystallization process in a-Si:F the crystallites organize as dendrite single crystals oriented along the 〈110〉 axis perpendicularly to the film surface. a-Si samples that had been covered by Pd or Al crystallize at appreciably lower temperatures. In the case of Al lower activation energies of 0.7 eV for hydrogenated and 0.4 eV for fluorinated a-Si are measured. In the case of Pd/a-Si:H,F for both kinds of a-Si an activation energy of 1.7 eV is found.
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  • 6
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 53 (1988), S. 1186-1188 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Effect of rapid thermal annealing (RTA) at 800, 1000, and 1200 °C on the Ni/Si3N4/Si system has been studied employing electron microscopy, Auger electron spectroscopy, and x-ray diffraction analysis. Formation of NiSi or NiSi2 silicides on the Ni/Si3N4 interface and of NiSi2 silicide on the Si3N4/Si interface was observed after RTA. This was a result of the diffusion of Si into deposited 250-nm-thick Ni layer and the diffusion of Ni through 140-nm-thick amorphous Si3N4 layer into the Si substrate. The diffusion coefficient of Ni in amorphous Si3N4 was estimated to be D(approximately-equal-to)103 exp(−3.2 eV/kT), cm2/s.
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  • 7
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 54 (1989), S. 901-903 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The formation of an interfacial AlN layer was observed in an Al/Si3 N4 thin-film system immediately after electron beam deposition of Al, employing Auger electron spectroscopy, x-ray diffraction, and transmission electron microscopy. Heat treatments up to 600 °C resulted in growth of this layer. The Si liberated by the direct reaction between Al and Si3 N4 was found to crystallize into small islands of peculiar fractal-like shape. The AlN layer acted as a diffusion barrier for diffusion of Al into Si3 N4 .
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  • 8
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 67 (1995), S. 389-391 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Fast oxidation of amorphous (a) Si1−xGex:H by interfacial reaction with SnO2 was observed at the temperature range of 400–500 °C. The rate of interfacial oxidation was very significant, while a test in a dry O2 ambient at the same temperatures showed no oxidation of Si1−xGex:H beyond the native oxide. The interfacial reaction of the SiGe:H/SnO2/glass system resulted in a layered structure of silicon oxide, tin oxide, and β-Sn at the SiGe/SnO2 interface. The extent of the interfacial reaction was found to depend on the Ge content in the Si1−xGex:H films; after annealing, the resultant silicon oxide layer is thicker for the Si-rich SiGe layer than for the Ge-rich composition. On the other hand, the SnO2 layer was totally reduced by an a-Ge:H top layer after a 1 h, 500 °C annealing procedure. © 1995 American Institute of Physics.
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  • 9
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Vacuum 27 (1977), S. 145-150 
    ISSN: 0042-207X
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
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  • 10
    ISSN: 0042-207X
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Type of Medium: Electronic Resource
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