ALBERT

All Library Books, journals and Electronic Records Telegrafenberg

feed icon rss

Your email was sent successfully. Check your inbox.

An error occurred while sending the email. Please try again.

Proceed reservation?

Export
Filter
  • American Institute of Physics (AIP)  (3)
Collection
Publisher
Years
  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Review of Scientific Instruments 69 (1998), S. 1499-1504 
    ISSN: 1089-7623
    Source: AIP Digital Archive
    Topics: Physics , Electrical Engineering, Measurement and Control Technology
    Notes: A modified broad beam ion source for low-energy hydrogen ion implantation of semiconductors is described. Based on a Kaufman type ion source two different solutions are presented: (a) an ion source with an extraction system consisting of two molybdenum grids with a low gas flow conductance reworked for hydrogen operation, and (b) a ten-grid mass separating ion beam system which enables the mass selection of H+, H2+, and H3+. The ion energy could be set in the range of 200–500 eV with a current density reaching from 1 to 100 μA/cm2. It is shown that at higher pressure the main ion created in the ion source is H3+ due to ion-molecule processes, whereas at lower pressure only H2+ and H+ are produced. Special consideration is given to the ion beam analysis of the two grid ion source operating in the 10−3 mbar range allowing to explain the different peak structures by the potential distribution across the ion source and different charge transfer processes. In addition, the analysis reveals neutral and ionized collision products in the ion beam. The ten-grid mass separating ion source could be operated in the 10−4 mbar range resulting in a nearly collision free ion beam which permits the generation of a mass separated hydrogen ion beam. © 1998 American Institute of Physics.
    Type of Medium: Electronic Resource
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
  • 2
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 71 (1997), S. 1362-1364 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The defect depth distribution caused by a 500 eV nitrogen ion beam etching (IBE) of an Al0.35Ga0.65As/GaAs multiple quantum well (MQW) structure was investigated by confocal photoluminescence (PL) measurements on a beveled section of the sample. The beveled section with an extremely small inclination angle necessary for the high depth resolution was fabricated by the IBE itself. Compared to other ion beam or plasma assisted etching processes reported, e.g., Ar-IBE, the 500 eV nitrogen IBE yields a very low defect density. A model including diffusion effects for the description of the profile gives a value of 4×10−15 cm2 /s for the defect diffusion coefficient. © 1997 American Institute of Physics.
    Type of Medium: Electronic Resource
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 85 (1999), S. 8378-8385 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The modification of the structural and electronic properties of InAs and InSb surfaces induced by low-energy N2 and Ar ion beam etching (IBE) were investigated as a function ion energy (≤500 eV) using Raman spectroscopy. A drastic enhancement of the electron concentration in the near surface region of both materials independent of the ion energy and the process gas was observed. From Raman measurements in different polarization configurations it can be concluded that the electron accumulation observed after IBE is inherently related to the process-induced structural defects. The degree of structural damage and the carrier concentration in the near surface region increase for higher ion energies. By controlled, subsequent removal of the damaged surface layer using wet etching, the depth profile of the structural and electronic damage in InAs was determined. This procedure reveals that the structural and electronic damage extends about 100 nm into the material. Nevertheless, it can be recognized that the utilization of N2 as the etching gas is associated with a lower degree of damage and also a lower electron accumulation at the surface of both InAs and InSb. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
Close ⊗
This website uses cookies and the analysis tool Matomo. More information can be found here...