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  • Mechanical Engineering  (76)
  • Computer Programming and Software  (61)
  • Electronics and Electrical Engineering  (58)
  • 2000-2004  (195)
  • 1
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    Solid-state Terahertz Sources for Space Applications (2004)
    In:  Other Sources
    Details
    Publication Date: 2019-07-27
    Description: This paper discusses the construction of solid-state frequency multiplier chains utilized far teraherz receiver applications such as the Herschel Space Observatory . Emphasis will he placed on the specific requirements to be met and challenges that were encountered. The availability of high power amplifiers at 100 GHz makes it possible to cascade frequency doublers and triplers with sufficient RF power to pump heterodyne receivers at THz frequencies. The environmental and mechanical constraints will be addressed as well as reliability issues.
    Keywords: Electronics and Electrical Engineering
    Format: text
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  • 2
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    Friction Stir Welding Development at National Aeronautics and Space Administration-Marshall Space Flight Center (2001)
    In:  Other Sources
    Details
    Publication Date: 2019-07-18
    Description: This paper presents an over-view of friction stir welding (FSW) process development and applications at Marshall Space Flight Center (MSFC). FSW process development started as a laboratory curiosity but soon found support from many users. The FSW process advanced very quickly and has found many applications both within and outside the aerospace industry. It is currently being adapted for joining key elements of the Space Shuttle External Tank for improved producibility and reliability. FSW process modeling is done to better understand and improve the process. Special tools have been developed to weld variable thickness materials including very thin and very thick materials. FSW is now being applied to higher temperature materials such as copper and to advanced materials such as metal matrix composites. FSW technology is being successfully transferred from MSFC laboratory to shop floors of many commercial companies.
    Keywords: Mechanical Engineering
    Type: TMS Conference; Nov 01, 2001; Indianapolis, IN; United States
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  • 3
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    Method of Fabricating a Piezoelectric Composite Apparatus (2003)
    In:  CASI
    Details
    Publication Date: 2019-08-13
    Description: A method for fabricating a piezoelectric macro-fiber composite actuator comprises providing a piezoelectric material that has two sides and attaching one side upon an adhesive backing sheet. The method further comprises slicing the piezoelectric material to provide a plurality of piezoelectric fibers in juxtaposition. A conductive film is then adhesively bonded to the other side of the piezoelectric material, and the adhesive backing sheet is removed. The conductive film has first and second conductive patterns formed thereon which are electrically isolated from one another and in electrical contact with the piezoelectric material. The first and second conductive patterns of the conductive film each have a plurality of electrodes to form a pattern of interdigitated electrodes. A second film is then bonded to the other side of the piezoelectric material. The second film may have a pair of conductive patterns similar to the conductive patterns of the first film.
    Keywords: Electronics and Electrical Engineering
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  • 4
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    Thin layer composite unimorph ferroelectric driver and sensor (2004)
    In:  CASI
    Details
    Publication Date: 2019-08-28
    Description: A method for forming ferroelectric wafers is provided. A prestress layer is placed on the desired mold. A ferroelectric wafer is placed on top of the prestress layer. The layers are heated and then cooled, causing the ferroelectric wafer to become prestressed. The prestress layer may include reinforcing material and the ferroelectric wafer may include electrodes or electrode layers may be placed on either side of the ferroelectric layer. Wafers produced using this method have greatly improved output motion.
    Keywords: Electronics and Electrical Engineering
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  • 5
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    Intelligent subsystem interface for modular hardware system (2000)
    In:  CASI
    Details
    Publication Date: 2019-07-12
    Description: A single chip application specific integrated circuit (ASIC) which provides a flexible, modular interface between a subsystem and a standard system bus. The ASIC includes a microcontroller/microprocessor, a serial interface for connection to the bus, and a variety of communications interface devices available for coupling to the subsystem. A three-bus architecture, utilizing arbitration, provides connectivity within the ASIC and between the ASIC and the subsystem. The communication interface devices include UART (serial), parallel, analog, and external device interface utilizing bus connections paired with device select signals. A low power (sleep) mode is provided as is a processor disable option.
    Keywords: Electronics and Electrical Engineering
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  • 6
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    Friction Stir Welding Development at NASA-Marshall Space Flight Center (2001)
    In:  CASI
    Details
    Publication Date: 2019-07-13
    Description: This paper presents an overview of friction stir welding (FSW) process development and applications at Marshall Space Flight Center (MSFC). FSW process development started as a laboratory curiosity but soon found support from many users. The FSW process advanced very quickly and has found many applications both within and outside the aerospace industry. It is currently being adapted for joining key elements of the Space Shuttle External Tank for improved producibility and reliability. FSW process modeling is done to better understand and improve the process. Special tools have been developed to weld variable thickness materials including thin and thick materials. FSW is now being applied to higher temperature materials such as copper and to advanced materials such as metal matrix composites. FSW technology is being successfully transferred from MSFC laboratory to shop floors of many commercial companies.
    Keywords: Mechanical Engineering
    Type: TMS Special Publication on Friction Stir Welding; Jan 01, 2001; Warrendale, PA; United States
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  • 7
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    A Software Architecture for Intelligent Synthesis Environments (2001)
    In:  Other Sources
    Details
    Publication Date: 2011-08-31
    Description: The NASA's Intelligent Synthesis Environment (ISE) program is a grand attempt to develop a system to transform the way complex artifacts are engineered. This paper discusses a "middleware" architecture for enabling the development of ISE. Desirable elements of such an Intelligent Synthesis Architecture (ISA) include remote invocation; plug-and-play applications; scripting of applications; management of design artifacts, tools, and artifact and tool attributes; common system services; system management; and systematic enforcement of policies. This paper argues that the ISA extend conventional distributed object technology (DOT) such as CORBA and Product Data Managers with flexible repositories of product and tool annotations and "plug-and-play" mechanisms for inserting "ility" or orthogonal concerns into the system. I describe the Object Infrastructure Framework, an Aspect Oriented Programming (AOP) environment for developing distributed systems that provides utility insertion and enables consistent annotation maintenance. This technology can be used to enforce policies such as maintaining the annotations of artifacts, particularly the provenance and access control rules of artifacts-, performing automatic datatype transformations between representations; supplying alternative servers of the same service; reporting on the status of jobs and the system; conveying privileges throughout an application; supporting long-lived transactions; maintaining version consistency; and providing software redundancy and mobility.
    Keywords: Computer Programming and Software
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  • 8
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    Overview of NASA's UEET Program (2002)
    In:  CASI
    Details
    Publication Date: 2004-12-03
    Description: This paper presents a general overview of NASA's Ultra Efficient Engine Technology (UEET) Program. The program's vision is to develop and hand off revolutionary turbine engine propulsion technologies that will enable future generation vehicles over a wide range of flight speeds. The specific goals include: 1) Perform propulsion technologies to enable increases in system efficiency and, therefore, fuel burn reductions of up to 15% (equivalent reductions in CO2); and 2) Provide combustor technologies (configuration and materials) which will enable reductions in Landing/Take-off (LTO) NOx of 70% relative to 1996 ICAO standards.
    Keywords: Mechanical Engineering
    Type: 2001 NASA Seal/Secondary Air System Workshop; Volume 1; 53-67; NASA/CP-2002-211911/VOL1
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  • 9
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    Overview of NASA Glenn Seal Development Program (2001)
    In:  CASI
    Details
    Publication Date: 2004-12-03
    Description: NASA Glenn hosted the Seals/Secondary Air System Workshop on October 25-26, 2000. Each year NASA and our industry and university partners share their respective seal technology developments. We use these workshops as a technical forum to exchange recent advancements and 'lessons-learned' in advancing seal technology and solving problems of common interest. As in the past we are publishing two volumes. Volume I will be publicly available and individual papers will be made available online through the web page address listed at the end of this chapter.
    Keywords: Mechanical Engineering
    Type: 2000 NASA Seal/Secondary Air System Workshop; Volume 1; 1-21; NASA/CP-2001-211208/VOL1
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  • 10
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    An Extremely Wide Bandwidth, Low-Noise SIS Heterodyne Receiver Design for Millimeter and Submillimeter Observations (2002)
    In:  CASI
    Details
    Publication Date: 2013-08-31
    Description: Millimeter and submillimeter heterodyne receivers using state-of-the-art SIS detectors are capable of extremely large instantaneous bandwidths with noise temperatures within a few Kelvin of the quantum limit. We present the design for a broadband, sensitive, heterodyne spectrometer under development for the Caltech Submillimeter Observatory (CSO). The 180-300 GHz double-sideband design uses a single SIS device excited by a full bandwidth, fixed-tuned waveguide probe on a silicon substrate. The IF output frequency (limited by the MMIC low noise IF preamplifier) is 6-18 GHz, providing an instantaneous RF bandwidth of 24 GHz (double-sideband). The SIS mixer conversion loss should be no more than 1-2 dB with mixer noise temperatures across the band within 10 K of the quantum limit. The single-sideband receiver noise temperature goal is 70 K. The wide instantaneous bandwidth and low noise will result in an instrument capable of a variety of important astrophysical observations beyond the capabilities of current instruments. Lab testing of the receiver will begin in the summer of 2002, and the first use on the CSO should occur in the spring of 2003.
    Keywords: Electronics and Electrical Engineering
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