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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 75 (1994), S. 3924-3927 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Reactive deposition epitaxy was used to synthesize thin layers of RexMo1−xSi2 on Si(100). In the case of x=1, ReSi2 layers of excellent crystalline quality have been reported previously [J. E. Mahan, K. M. Geib, G. Y. Robinson, R. G. Long, Y. Xinghua, G. Bai, and M.-A. Nicolet, Appl. Phys. Lett. 56, 2439 (1990)]. In the case of x=0, however, virtually no alignment of the MoSi2 and the substrate is found, although this silicide is nearly isomorphic to ReSi2. For intermediate values of x, highly epitaxial ternary silicides are obtained, at least for a Mo fraction up to 1/3.
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 75 (1994), S. 3882-3891 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The inversion of a bilayer of Co on top of Ti and a Si(100) substrate upon steady-state annealing, and the resultant formation of an epitaxial CoSi2 layer have been studied using both reactive (N2, N2+5% H2, He+14% H2) and nonreactive (vacuum) annealing ambients. In nitrogen, a high-quality, single-crystalline CoSi2 layer forms above 600 °C for 30 min, with an abrupt interface to the substrate. As the fraction of hydrogen in the ambient increases, the abruptness of the interface deteriorates slightly. On top of this silicide, the Ti is chemically bound with oxygen present as a contaminant. In the case of a nonreactive annealing ambient, the Co/Ti inversion still takes place, although it is only partial. Moreover, the interface is very rough. The structure is unstable above 800 °C for 30 min annealing and transforms into a mixed layer of Co0.25Ti0.75Si2 and epitaxial CoSi2 grains. Using isothermal vacuum annealings with varying durations, a square-root time dependence is observed for the growth of the epitaxial CoSi2 in a temperature range around 700 °C. An activation energy of Ea=3.5 eV is found for that process, which is higher than the 2.3 eV reported for the polycrystalline growth of CoSi2 and is attributed to this structural dissimilarity.
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Review of Scientific Instruments 72 (2001), S. 1589-1590 
    ISSN: 1089-7623
    Source: AIP Digital Archive
    Topics: Physics , Electrical Engineering, Measurement and Control Technology
    Notes: Graphite coated with a thin layer of photoresist and annealed in an inert ambient to vitrify the coating makes light, smooth substrates that are as good as polished diamond for the analysis of thin films by MeV He backscattering spectrometry. © 2001 American Institute of Physics.
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  • 4
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The growth of Ti and the formation of epitaxial Ti silicide on Si(111)-7×7 were investigated by using reflection high-energy electron diffraction (RHEED) and high-resolution transmission electron microscopy (HRTEM). The growth mode of Ti is Stransky–Krastanov type when the substrate temperature is room temperature (RT). On the other hand, it is Volmer–Weber type when the substrate temperature is ∼550 °C. The HRTEM lattice image and transmission electron diffraction pattern show that C54 TiSi2 is grown epitaxially on a Si substrate when 160 ML of Ti is deposited on a Si(111)-7×7 surface at RT followed by in situ annealing at 750 °C for 10 min in ultrahigh vacuum (UHV). The TiSi2/Si interface is somewhat incoherent, but the developed TiSi2 crystallites are single crystal with matching face relationships of TiSi2(111)(parallel)Si(111), TiSi2(311)(parallel)Si(111), and TiSi2(022)(parallel)Si(111). A thin single-crystal Si overlayer with [111] direction is grown on the TiSi2 surface when TiSi2/Si(111) is annealed at ∼900 °C in UHV, which is confirmed by observing the Si(111)-7×7 RHEED pattern.
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  • 5
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The structural and electrical characteristics of 300 keV Si+ or 380 keV Ar+ ion-implanted epitaxial ReSi2 films grown on an n-Si(100) substrate have been studied by using 2 MeV 4He+ ion backscattering spectrometry, x-ray diffraction, high-resolution transmission electron microscopy, and electrical measurement. Ion implantation causes static disorder in the film, which overlap and grow to become an amorphous layer. The threshold dose for amorphizing the ReSi2 film is ∼5×1014/cm2 for 28Si+ and ∼1×1014/cm2 for 40Ar+. Although the resistivity of the implanted ReSi2 film decreases when the degree of disorder (or the implantation dose) is increased, the resistivity reaches a minimum value at a dose of ∼1×1015/cm2 for Si+ or ∼5×1014/cm2 for Ar+. The 28Si+-implanted amorphous ReSi2 films recovered original epitaxy after thermal annealing at 700 °C for 30 min in vacuum, as do the partly amorphized ReSi2 films by 40Ar+ implantation. On the other hand, those films fully amorphized by 40Ar+ implantation (dose≥1×1014/cm2) did not recover after thermal annealing, even when exposed to a temperature as high as 1000 °C for 30 min.
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 69 (1991), S. 2201-2205 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The strain of porous Si formed on p+-Si wafers without and with GeSi or CoSi2 capping layers were analyzed by double crystal x-ray diffractometry, MeV 4He backscattering spectrometry, and Auger electron spectroscopy. The parallel strain is zero for all the samples. The perpendicular strain of uncapped porous Si is positive, and decreases from ∼0.3% to ∼−0.6% upon vacuum annealing at 600 °C for 30 min. That of GeSi-capped porous Si is negative (∼−0.1%) and remains unchanged upon the same annealing. The perpendicular strain of CoSi2-capped porous Si also decreases due to the pinholes in the CoSi2 layer. We propose that the decrease of strain upon thermal annealing in vacuum is a result of the desorption of physisorbed gas molecules from the native oxide of the pore walls in the porous Si layer. The strain of annealed uncapped-porous Si increases again when stored in ambient air at room temperature, with a time constant on the order of days, while no change was detected for the annealed GeSi-capped porous Si. A little increase was observed for the annealed CoSi2-capped porous Si due to the existence of the pinholes. We attribute the increase of strain to adsorption of gas molecules (H2O in particular) from air.
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  • 7
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 58 (1991), S. 1884-1886 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We used 2 MeV 4He backscattering spectrometry, x-ray diffractometry, and the van der Pauw technique to study how epitaxial ReSi2 films on Si(100) change structurally and electrically upon room-temperature implantation of 300 keV 28Si or 380 keV 40Ar. The as-grown film has a minimum channeling yield of ∼2% for Re, and a resistivity of ∼23 mΩcm at room temperature. Ion implantation produces damage in the film, which increases monotonically with dose. At a dose of either 5×1014 28Si/cm2 or 1×1014 40Ar/cm2, the entire ReSi2 film becomes both x-ray and channeling amorphous. The resistivity of the film decreases monotonically with dose. The amorphous film has a resistivity of ∼1.2 mΩcm at room temperature. Upon annealing in vacuum at 700 °C for 30 min, the damage anneals out and the amorphous ReSi2 film recrystallizes epitaxially, once again exhibiting a minimum channeling yield of ∼2% for Re and a resistivity of ∼23 mΩcm.
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  • 8
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 57 (1990), S. 2247-2249 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The strain in a porous Si layer formed by anodization of a crystalline p+-Si(100) wafer in a HF electrolyte was measured by double-crystal x-ray diffractometry. The perpendicular strain in the as-formed porous Si layer is ∼10−3. The parallel strain is not measurable (〈10−4). Upon annealing in vacuum from 200–800 °C, at elevated temperature, the perpendicular strain decreases while the parallel strain remains zero. Subsequently, the perpendicular strain of the annealed sample increases by amounts that depend on the ambient. The observed changes of strain in porous Si layers are explained as being mainly caused by modification of the stress in the native oxide layer due to desorption and absorption of gas. We propose that the strain in porous Si is the net result of stress induced by surface tension, oxide formation, and exchange of gas between the oxide and ambient.
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  • 9
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 56 (1990), S. 2439-2441 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: ReSi2 thin films were grown on (001) silicon wafers by vacuum evaporation of rhenium onto hot substrates in ultrahigh vacuum. The preferred epitaxial relationship was found to be ReSi2 (100)/Si(001) with ReSi2 [010](parallel)Si〈110〉. The lattice matching consists of a common unit mesh of 120 A(ring)2 area, and a mismatch of 1.8%. Transmission electron microscopy revealed the existence of rotation twins corresponding to two distinct but equivalent azimuthal orientations of the common unit mesh. Although the lateral dimension of the twins is on the order of 100 A(ring), MeV He+ backscattering spectrometry revealed a minimum channeling yield of 2% for a ∼1500-A(ring)-thick film grown at 650 °C. There is a very high degree of alignment between the ReSi2 (100) and the Si(001) planes.
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  • 10
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 56 (1990), S. 2126-2128 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Epitaxial thin films of the semiconducting transition metal silicide, beta-FeSi2, were grown on (001) silicon wafers. The observed matching face relationship is FeSi2(100)/Si(001), with the azimuthal orientation being FeSi2[010]||||Si〈110〉. This heteroepitaxial relationship has a common unit mesh of 59 A(ring)2 area, with a mismatch of 2.1%. There is a strong tendency toward island formation within this heteroepitaxial system.
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