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  • Articles  (255)
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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 5695-5701 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Electron transport properties in GaAs n+-n-n+ structures with varying doping profiles (in the direction of electron transport) are investigated using self-consistent ensemble Monte Carlo simulations. In particular, we study the effects of ramp doping [i.e., linearly increasing (ramp-up) or decreasing (ramp-down) doping density within the n region] and spike doping (i.e., introducing one or more n+ spikes in the n region) on electron transport to assess differences, advantages, and potential applications of these doping profiles on device performance. Underlying physical mechanisms for electron transport in these structures are analyzed. Simulation results reveal that overall electron transport can be improved significantly by employing ramp-up (rather than ramp-down) doping and multispike (instead of single-spike) doping schemes. Potential advantages of variable doping in field-effect transistor applications include enhanced current drive capability, reduced source resistance, and improved breakdown characteristics.
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 86 (1999), S. 5850-5857 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: In this article, we discuss parameters influencing (a) the properties of thin AlxGa1−xN layers grown by metalorganic chemical vapor deposition and (b) the electrical properties of the two-dimensional electron gas (2DEG) forming at the AlxGa1−xN/GaN heterojunction. For xAl〉0.3, the AlxGa1−xN layers showed a strong tendency towards defect formation and transition into an island growth mode. Atomically smooth, coherently strained AlxGa1−xN layers were obtained under conditions that ensured a high surface mobility of adsorbed metal species during growth. The electron mobility of the 2DEG formed at the AlxGa1−xN/GaN interface strongly decreased with increasing aluminum mole fraction in the AlxGa1−xN layer and increasing interface roughness, as evaluated by atomic force microscopy of the surfaces prior to AlxGa1−xN deposition. In the case of modulation doped structures (GaN/AlxGa1−xN/AlxGa1−xN:Si/AlxGa1−xN), the electron mobility decreased with decreasing thickness of the undoped spacer layer and increasing silicon doping. The electron mobility was only moderately affected by the dislocation density in the films and independent of the growth temperature of the AlxGa1−xN layers at xAl=0.3. For Al0.3Ga0.7N/GaN heterojunctions, electron mobility values up to 1650 and 4400 cm2/V s were measured at 300 and 15 K, respectively. © 1999 American Institute of Physics.
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  • 3
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Two schemes of nucleation and growth of gallium nitride on Si(111) substrates are investigated and the structural and electrical properties of the resulting films are reported. Gallium nitride films grown using a 10–500 nm-thick AlN buffer layer deposited at high temperature (∼1050 °C) are found to be under 260–530 MPa of tensile stress and exhibit cracking, the origin of which is discussed. The threading dislocation density in these films increases with increasing AlN thickness, covering a range of 1.1 to 〉5.8×109 cm−2. Films grown using a thick, AlN-to-GaN graded buffer layer are found to be under compressive stress and are completely crack free. Heterojunction field effect transistors fabricated on such films result in well-defined saturation and pinch-off behavior with a saturated current of ∼525 mA/mm and a transconductance of ∼100 mS/mm in dc operation. © 2001 American Institute of Physics.
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  • 4
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The emission mechanisms of bulk GaN and InGaN quantum wells (QWs) were studied by comparing their optical properties as a function of threading dislocation (TD) density, which was controlled by lateral epitaxial overgrowth. Slightly improved excitonic photoluminescence (PL) intensity was recognized by reducing TD density from 1010 cm−2 to less than 106 cm−2. However, the major PL decay time was independent of the TD density, but was rather sensitive to the interface quality or material purity. These results suggest that TDs simply reduce the net volume of light-emitting area. This effect is less pronounced in InGaN QWs where carriers are effectively localized at certain quantum disk size potential minima to form quantized excitons before being trapped in nonradiative pathways, resulting in a slow decay time. The absence of any change in the optical properties due to reduction of TD density suggested that the effective band gap fluctuation in InGaN QWs is not related to TDs. © 1999 American Institute of Physics.
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  • 5
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 73 (1998), S. 747-749 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Extended defect reduction in GaN grown by lateral epitaxial overgrowth (LEO) on large-area SiO2/GaN/Al2O3 wafers by low pressure metalorganic chemical vapor deposition is characterized using transmission electron microscopy and atomic force microscopy. The laterally overgrown GaN (LEO GaN) has a rectangular cross section with smooth (0001) and {112¯0} facets. The density of mixed-character and pure edge threading dislocations in the LEO GaN (〈5×106 cm−2) is reduced by at least 3–4 orders of magnitude from that of bulk GaN (∼1010 cm−2). A small number of edge dislocations with line directions parallel to the basal plane are generated between the bulk-like overgrown GaN and the LEO GaN regions as well as at the intersection of adjacent merging LEO GaN stripes. The edge dislocations are most likely generated to accommodate the small misorientation between bulk-like GaN and LEO GaN regions as well as between adjacent single-crystal LEO GaN stripes. © 1998 American Institute of Physics.
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  • 6
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 69 (1996), S. 1438-1440 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We report record high breakdown voltages up to 340 and 230 V realized on unintentionally doped (1.5 μm gate length) and Si doped (1 μm gate length) AlGaN/GaN modulation doped field effect transistors (MODFETs), respectively. The devices also have large transconductances up to 140 mS/mm and a full channel current of 150–400 mA/mm. The Si doped MODFET sample demonstrated a very high room temperature mobility of 1500 cm2/Vs. With these specifications, GaN field effect transistors as microwave power devices are practical. © 1996 American Institute of Physics.
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  • 7
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 68 (1996), S. 1371-1373 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The structure and morphology of low growth temperature GaN nucleation layers have been studied using atomic force microscopy (AFM), reflection high energy electron diffraction (RHEED), and transmission electron microscopy (TEM). The nucleation layers were grown at 600 °C by atmospheric pressure metalorganic chemical vapor deposition (MOCVD) on c-plane sapphire. The layers consist of predominantly cubic GaN (c-GaN) with a high density of stacking faults and twins parallel to the film/substrate interface. The average grain size increases with increasing layer thickness and during the transition from low temperature (600 °C) to the high temperatures (1080 °C) necessary for the growth of device quality GaN. Upon heating to 1080 °C the nucleation layer partially converts to hexagonal GaN (h-GaN) while retaining a high stacking fault density. The mixed cubic-hexagonal character of the nucleation layer region is sustained after subsequent high-temperature GaN growth. © 1996 American Institute of Physics.
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 64 (1988), S. 3476-3480 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The quality of GaInAs-AlInAs epitaxial layers is found to be critically dependent on the degree of (100)-InP substrate misorientation. The alloy quality of both materials is improved when the substrate is misoriented 4° off the (100). The heterojunction interface quality as determined by the full width at half-maximum of quantum-well photoluminescence is also improved when a substrate misoriented by 4° is used. A degradation of both alloy and interface quality as compared to material on (100) InP is observed when the misorientation is 2°. These effects are also observed for strained quantum-well structures.
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  • 9
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 62 (1993), S. 169-171 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The precipitation of arsenic in low temperature GaAs uniformly doped with Si and Be has been studied by transmission electron microscopy. Following an in situ anneal at 600 °C, precipitate size and density is found to be strongly dependent on the dopant type. Impurities at the epilayer/substrate interface lead to heterogeneous nucleation of precipitates. Although precipitates were observed to nucleate heterogeneously at threading dislocations, the precipitates predominantly form homogeneously. These results are consistent with the general theory of precipitation in solids.
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  • 10
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 62 (1993), S. 2209-2211 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Single-crystal Ga1−xInxAs (x=0.4) grown on InP by molecular-beam epitaxy at low substrate temperatures (250–150 °C) has been examined by transmission electron microscopy. Arsenic precipitates were observed following an ex situ anneal at 550 °C. The precipitates coarsen during higher-temperature anneals at 600 and 700 °C. Microstructure dependence on the growth temperature was similar to that observed in low-temperature grown GaAs. Arsenic precipitate volume fraction increased with decreasing growth temperature, with a measured maximum value of ∼0.4%.
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