ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
It presented a novel manufacturing method that was derived from traditional hot embossing technology to fabricate actuators on polymer material in this paper. The conventional photolithography technology, electroplating, and hot embossing technology were utilized in this process. The plastic deformation properties of thermoplastic polymers were main concept. The metal layer deposited on the silicon wafer could be embedded into the polymer substrate by hot embossingtechnology as temperature being above Tg. When the polymer substrate temperature was cooled below the Tg, the polymer is to de-embossing and remove silicon wafer. The metal layer was transferred from silicon wafer to be embedded in the polymer substrate. Owing to the adhesion between the metal layer and polymer material was more than the metal layer and silicon wafer. For instance, the PMMA was employed as the polymer substrate to fabricate the cantilever beam actuatorusing the novel technology. Finally, the beam was driven by electrostatic force through 25volts of DC power
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/11/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.505-507.103.pdf
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