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  • 1
    Publication Date: 2020-07-20
    Description: This paper is devoted to the analysis of the influence of thermal pads on electric, optical, and thermal parameters of power LEDs. Measurements of parameters, such as thermal resistance, optical efficiency, and optical power, were performed for selected types of power LEDs operating with a thermal pad and without it at different values of the diode forward current and temperature of the cold plate. First, the measurement set-up used in the paper is described in detail. Then, the measurement results obtained for both considered manners of power LED assembly are compared. Some characteristics that illustrate the influence of forward current and temperature of the cold plate on electric, thermal, and optical properties of the tested devices are presented and discussed. It is shown that the use of the thermal pad makes it possible to achieve more advantageous values of operating parameters of the considered semiconductor devices at lower values of their junction temperature, which guarantees an increase in their lifetime.
    Electronic ISSN: 1996-1073
    Topics: Energy, Environment Protection, Nuclear Power Engineering
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  • 2
    Publication Date: 2020-06-17
    Description: Temperature is an essential factor affecting the operation of light-emitting diodes (LEDs), which are often used in circuits containing multiple devices influencing each other. Therefore, the thermal models of such circuits should take into account not only the self-heating effects, but also the mutual thermal influences among devices. This problem is illustrated here based on the example of a module containing six LEDs forming on the substrate a hexagon. This module is supposed to operate without any heat sink in the natural convection cooling conditions, hence it has been proposed to increase the thermal pad area in order to lower the device-operating temperature. In the experimental part of the paper, the recorded diode-heating curves are processed using the network identification by deconvolution method. This allows for the computation of the thermal time constant spectra and the generation of device-compact thermal models. Moreover, the influence of the thermal pad surface area on the device temperature and the thermal coupling between LEDs is investigated.
    Electronic ISSN: 1996-1073
    Topics: Energy, Environment Protection, Nuclear Power Engineering
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  • 3
    Publication Date: 2019-05-07
    Description: Light-emitting diodes are nowadays the most dynamically developing type of light sources. Considering that temperature is the main factor affecting the electrical and lighting parameters of these devices, thermal models are essential subcomponents of the multidomain models commonly used for simulation of their operation. The authors investigated white power light-emitting diodes soldered to Metal Core Printed Circuit Boards (MCPCBs). The tested devices were placed in a light-tight box on a cold plate and their cooling curves were registered for different diode heating current values and various preset cold plate temperatures. These data allowed the computation of optical and real heating power values and consequently the generation of compact thermal models in the form of Foster and Cauer RC ladders. This also rendered possible the analysis of the influence of the considered factors on the compact model element values and their parametrization. The resulting models yield accurate values of diode junction temperature in most realistic operating conditions and they can be easily included in multidomain compact models of power light emitting diodes.
    Electronic ISSN: 1996-1073
    Topics: Energy, Environment Protection, Nuclear Power Engineering
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