ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Distributions of residual stress in diffusion bonding of dissimilar materials intermetallicsTiAl to steel 40Cr were simulated by FEM calculation. Results showed that destructive residualstresses presented in the minute area adjacent to bond-line of the base material with the smallerthermal expansion coefficient. Reducing bonding temperature and diminishing bonding time are infavor of the mollification of interface tresses. Concepts of the residual stress factor Rf and thethickness factor Tf were propounded. As selecting the interlayer, the interlayer with smaller |Rf| andTf should be given precedence, and with a prerequisite of sufficient physical contact small thicknessof the interlayer are finer
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/55/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.353-358.1939.pdf
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