Electronic Resource
Woodbury, NY
:
American Institute of Physics (AIP)
Applied Physics Letters
74 (1999), S. 1767-1769
ISSN:
1077-3118
Source:
AIP Digital Archive
Topics:
Physics
Notes:
A multilayer structure for thermionic cooling is proposed. This structure uses semiconductor heterojunctions for barriers and a varying current density across the junctions. Compared with the conventional multijunction thermionic cooler with a uniform current density, the design can yield a significantly higher temperature gradient, thus cooling more effectively. © 1999 American Institute of Physics.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.123682
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