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    American Institute of Physics (AIP)
    Publication Date: 2014-03-01
    Description: Stress gradients generated near the top surface of Cu thin films by capping layers, as measured using a combination of conventional and glancing incidence x-ray diffraction, exhibit heterogeneous behavior that is directly related to plastic anisotropy within the Cu grains. A comparison of stress gradients measured from several x-ray reflections to their corresponding Schmid factors yields a consistent, critical resolved shear stress. The results experimentally verify that dislocation-mediated plasticity is responsible for the creation of stress gradients at the Cu film/cap interface. Depth-dependent measurements reveal that the observed gradients are localized to within 200 nm of this interface.
    Print ISSN: 0003-6951
    Electronic ISSN: 1077-3118
    Topics: Physics
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