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    A hermetic sealing process for large irregularly shaped hybrid microcircuit enclosures (1977)
    In:  Other Sources
    Details
    Publication Date: 2011-08-17
    Description: A system for sealing vacuum baked hybrids in a dry inert atmosphere using an overlapping spot resistance weld is described. A unique electrode configuration and fixturing that permits sealing of large and irregularly shaped gold plated Kovar packages to the hermeticity requirements of MIL-STD-883 was discussed. Metallurgical considerations and comparisons to laser sealing were made. Problems encountered during the development and optimization of the process were highlighted. Solutions to plating, fixturing, warpage, weld splatter and cracked bead problems are presented.
    Keywords: ELECTRONICS AND ELECTRICAL ENGINEERING
    Type: NASA. Marshall Space Flight Center Proc. of the 1977 NASA(ISHM Microelectronics Conf.; p 95-110
    Format: text
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