ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
In nano-imprint lithography (NIL) process, which has shown to be a good method tofabricate polymeric patterns, several kinds of pattern defects due to thermal effects during polymerflow and mold release operation have been reported. A typical defect in NIL process with high aspectratio and low resist thickness pattern is a resist fracture during the mold release operation. It seemsdue to interfacial adhesion between polymer and mold. In the present investigation, FEM simulationof NIL process was carried out to predict the defects of the polymer pattern and to optimize theprocess by FEA. To achieve the above mentioned purpose, FEM simulation technique based onconstitutive modeling of polymer with experiments was firstly investigated [1]. Secondly, theembossing operation in NIL process was investigated in detail by FEM. From the analytical results, itwas found that the non-uniform flow-pattern of polymer and the applied pressure in the embossingoperation induce the cavity and the drastic lateral-strain at the edge of pattern. It was also shown thatthe low polymer-thickness result in the delamination of polymer from the substrate. It seems that theabove phenomena cause the defects of the final polymer pattern
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/54/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.345-346.665.pdf
