Springer Online Journal Archives 1860-2000
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Abstract Modulation doped Al0.3Ga0.7As/In x Ga1−x As/GaAs high electron mobility transistor structures for device application have been grown using molecular beam epitaxy. Initially the critical layer thickness for InAs mole fractions up to 0.5 was investigated. For InAs mole fractions up to 0.35 good agreement with theoretical considerations was observed. For higher InAs mole fractions disagreement occurred due to a strong decrease of the critical layer thickness. The carrier concentration for Al0.3Ga0.7As/In x Ga1−x As/GaAs high electron mobility transistor structures with a constant In x Ga1−x As quantum well width was investigated as a function of InAs mole fraction. If the In x Ga1−x As quantum well width is grown at the critical layer thickness the maximum carrier concentration is obtained for an InAs mole fraction of 0.37. A considerable higher carrier concentration in comparison to single-sided δ-doped structures was obtained for the structures with δ-doping on both sides of the In x Ga1−x As quantum well. Al0.3Ga0.7As/In x Ga1−x As/GaAs high electron mobility transistor structures with InAs mole fractions in the range 0–0.35 were fabricated for device application. For the presented field effect transistors best device performance was obtained for InAs mole fractions in the range 0.25–0.3. For the field effect transistors with an InAs mole fraction of 0.25 and a gate length of 0.15 μm a f T of 115 GHz was measured.
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