Publication Date:
2019-07-13
Description:
This presentation is a NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond. This roadmap provides a snapshot for current plans and collaborations on testing and evaluation of electronics as well as a discussion of the technology selection approach.
Keywords:
Electronics and Electrical Engineering
Type:
GSFC-E-DAA-TN27832
,
2015 Radiation Hardened Electronics Technology (RHET); Nov 16, 2015 - Nov 18, 2015; Albuquerque, NM; United States
Format:
application/pdf