Publication Date:
2019-07-13
Description:
Gold thick-film metallization and 96 alumina substrate based prototype packaging system developed for 500C SiC electronics and sensors is briefly reviewed, the needs of improvement are discussed. A high temperature co-fired alumina material system based packaging system composed of 32-pin chip-level package and printed circuit board is discussed for packaging 500C SiC electronics and sensors.
Keywords:
Electronics and Electrical Engineering
Type:
GRC-E-DAA-TN26670
,
2015 Electronics Packaging Symposium; Sep 15, 2015 - Sep 16, 2015; Niskayuna, NY; United States
Format:
application/pdf