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Comparative evaluation of optical waveguides as alternative interconnections for high performance packaging (1992)

Hwang, L.-T. ; Schacham, S. E. ; Veatch, Mark S. ; [et al.]

In: CASI

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Publication Date: 2013-08-29

Description: A detailed comparison between optical and electrical interconnections is presented, with emphasis on advantages and drawbacks of optical link utilization. The impact of attenuation, dispersive degradation, and fan out on signal integrity is discussed. Reflections from discontinuities are taken into account in the section on fan out. According to our results, there is no obvious advantage of using optical interconnections for the distribution of digital signals containing significant frequency components in excess of 10 GHz, unless substantial distances are involved, for which low dispersion optical waveguides could provide a solution. The implementation of a polyimide optical waveguide in the MCNC package is discussed.

Keywords: COMMUNICATIONS AND RADAR

Type: Solid State Technology Branch of NASA Lewis Research Center; p 83-92

Format: text

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