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    Comb/serpentine/cross-bridge test structure for fabrication process evaluation (1988)
    In:  Other Sources
    Details
    Publication Date: 2018-12-01
    Description: The comb/serpentine/cross-bridge structure was developed to monitor and evaluate same layer shorts and step coverage problems (open and high-resistance wire over steps) for integrated circuit fabrication processes. The cross-bridge provides local measurements of wire sheet resistance and wirewidth. These local parametric measurements are used in the analysis of the serpentine wire, which identifies step coverage problems. The comb/serpentine/cross-bridge structure was fabricated with 3 microns CMOS/bulk p-well process and tested using a computer-controlled parametric test system.
    Keywords: ELECTRONICS AND ELECTRICAL ENGINEERING
    Format: text
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