Publication Date:
2019-06-28
Description:
The advantages of silicon piezoresistive strain sensing technology are being used to achieve the objectives of state of the art pressure sensors for SSME applications. The integration of multiple functions on a single chip is the key attribute being exploited. Progress is reported in transducer packaging and materials; silicon resistor characterization at cryogenic temperatures; chip mounting; and frequency response optimization.
Keywords:
INSTRUMENTATION AND PHOTOGRAPHY
Type:
NASA-CR-171125
,
NAS 1.26:171125
,
MPR-7
Format:
application/pdf