Publication Date:
2019-06-28
Description:
To obtain a more vibration resistant pressure sensor for use on the Space Shuttle Main Engine, a proximity probe based, diaphragm type pressure sensor breadboard was developed. A fiber optic proximity probe was selected as the sensor. In combination with existing electronics, a thermal stability evaluation of the entire probe system was made. Based upon the results, a breadboard design of the pressure sensor and electronics was made and fabricated. A brief series of functional experiments was made with the breadboard to calibrate, thermally compensate, and linearize its response. In these experiments, the performance obtained in the temperature range of -320 F (liquid N2) to +200 F was comparable to that of the strain gage based sensor presently in use on the engine. In tests at NASA-Marshall Space Flight Center (MSFC), after some time at or near liquid nitrogen temperatures, the sensor output varied over the entire output range. These large spurious signals were attributed to condensation of air in the sensing gap. In the next phase of development of this sensor, an evaluation of fabrication techniques toward greater thermal and mechanical stability of the fiber probe assembly must be made. In addition to this, a positive optics to metal seal must be developed to withstand the pressure that would result from a diaphragm failure.
Keywords:
INSTRUMENTATION AND PHOTOGRAPHY
Type:
NASA-CR-171143
,
NAS 1.26:171143
,
MTI-84TR35
Format:
application/pdf
