ISSN:
1662-9779
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Physics
Notes:
We investigated the non-uniformity of the residual layer thickness caused by wafer deformation inan experiment that examined different wafer thicknesses using UV-NIL with an element-wise patterned stamp(EPS). Experiments using the EPS were performed on an EVG®620-NIL. Severe deformation of the waferserved as an obstacle to the spread of resin drops, which caused non-uniformity of the residual layer thickness.We also simulated the imprint process using a simplified model and finite element method to analyze thenon-uniformity
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/23/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.121-123.649.pdf