ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The calculating model of surface non-uniformity of polishing pad and the kinematicalmodel between polishing pad and conditioner are initially established. Then the effects of severalconditioning parameters were investigated by using the two models. The results of simulation andcalculation show that the width ratio of diamond band of conditoner and the rotation speed at the samespeed ratio between pad and conditioner have little effect on the surface non-uniformity of polishingpad, while at high non-integer rotation speed ratio, the surface non-uniformity of polishing pad isbetter than that at low integer speed ratio. The research results are available to select appropriateconditioning parameters especially for the stringent requirement of within-wafer non-uniformity innext generation IC
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/57/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.389-390.498.pdf