ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
An innovative fixed abrasive grinding process of chemo-mechanical grinding (CMG) byusing soft abrasive grinding wheel (SAGW) has been recently proposed to achieve a damage-freeground workpiece surface. The basic principle, ideas and characteristics of CMG with SAGW arebriefly introduced in this paper. The CMG experiments using newly developed SAGW for Si waferare conducted at the condition of dry grinding. The grinding performances are evaluated and analyzedin terms of surface roughness, surface topography and surface/subsurface damage of ground wafer byuse of Zygo interferometer, ScanIntroductionning Electron Microscope (SEM) and Cross-section TransmissionElectron Microscope (Cross-section TEM). The component of product of ground Si surface is studiedby X-ray Photoelectron Spectroscopy (XPS) to verify chemical reaction between the abrasive /additives of grinding wheel and Si wafer. The CMG process model by using SAGW is developed tounderstand the material removal mechanism and generation principle of damage-free surface. Thestudy results show that the material removal mechanism of CMG by using SAGW can be explained asa hybrid process of chemical and mechanical action
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/57/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.389-390.459.pdf
