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Noncontact flash method for measuring thermal expansion of foil specimens (1993)

Heng, Wang ; Guanhu, He ; Benlian, Zhou ; [et al.]

[S.l.] : American Institute of Physics (AIP)

Review of Scientific Instruments 64 (1993), S. 3617-3619

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ISSN: 1089-7623

Source: AIP Digital Archive

Topics: Physics , Electrical Engineering, Measurement and Control Technology

Notes: A noncontact flash method for measuring thermal expansion of foil materials has been developed using laser-pulse thermal-conductivity equipment (H. Guanhu, Proceedings of the 1st Asian Thermophysical Properties Conference, 1986, p. 331), which is usually used for measuring thermal diffusivity, specific heat, and thermal conductivity. The automatic measurement of thermal expansion of foil materials can be realized if some low-cost accessories are simply added to the thermal-conductivity equipment. Thermal expansion of pure copper was measured to check the validity of this new method, and that of constantan foil with thickness 5 μm was also measured.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1063/1.1144238

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