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Improvement of YBa2Cu3O7−x thick films by doping with silver (1989)

Miller, J. H. ; Holder, S. L. ; Hunn, J. D. ; [et al.]

Woodbury, NY : American Institute of Physics (AIP)

Applied Physics Letters 54 (1989), S. 2256-2258

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ISSN: 1077-3118

Source: AIP Digital Archive

Topics: Physics

Notes: Composite thick films of YBa2Cu3O7−x and silver have been prepared on alumina substrates using a paint-on method. It is found that thick films containing greater than about 10% silver by weight have greatly reduced normal resistivities for T〉Tc (onset) and significantly enhanced Tc (R=0) as compared with undoped films processed under identical conditions. These results are interpreted in terms of enhanced grain growth and an improved coupling between grain boundaries because of proximity-induced electron pairing in the silver regions.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1063/1.101518

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