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Analysis of crack growth in solder joints (1999)

Shangguan, Dongkai

Bradford : Emerald

Soldering & surface mount technology 11 (1999), S. 27-32

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ISSN: 0954-0911

Source: Emerald Fulltext Archive Database 1994-2005

Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics

Notes: Understanding crack growth in solder joints is important for predicting the fatigue life of solder interconnects. In this paper, crack propagation in solder joints made of two solder alloys, 62Sn/36Pb/2Ag (by weight), a commonly used solder paste for SMT reflow applications, and 96.5Sn/3.5Ag (by weight), a lead-free solder alloy, was examined during thermal cycling. Based on these observations, the rate of crack propagation was estimated. Microstructural changes in the solder during thermal cycling were also studied.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1108/09540919910293847

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