ISSN:
1432-0630
Keywords:
81.40
;
82.65
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Abstract Laser-induced maskless etching of III–V compound semiconductors (InSb, GaAs, and InP) in a KOH aqueous solution by irradiation with a focused argon-ion laser has been investigated to obtain high etching rates and aspect ratios of etched grooves. The etching rate at low laser power was found to depend on the carrier density of the sample and its type. With the increase of the laser power, the etching reaction becomes primarily a thermochemical reaction. High etching rates and aspect ratios have been achieved with a single scan of the laser beam. The damage induced by laser wet etching is less than that by laser dry etching, and the damage at the etched side wall is less than that at the etched bottom. Grooves with locally controlled depth and slab structures have been fabricated for application.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF00324353
