ISSN:
1432-5225
Source:
Springer Online Journal Archives 1860-2000
Topics:
Agriculture, Forestry, Horticulture, Fishery, Domestic Science, Nutrition
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Summary The effect of moisture and level of stressing on the rate of creep and time to failure is studied for UF and MUF bonded particleboard. Response curves were fitted to a 4-element rheological model with a high degree of accuracy for four levels of stressing and for three levels of relative humidity at 20°C. Values of relative creep increased with time and also with increased levels of stress and r.h. The ratio of stress to deflection — presented either as the creep modulus or as isochronous curves — decreased rapidly with time. Particleboard is demonstrated to exhibit non-linear viscoelastic properties, particularly at the higher levels of stress. Deflection was increased and time to failure decreased when r.h. was raised from 65 to 90 per cent, but no significant statistical change was noted between 30 and 65 per cent r.h. Increased levels of stress caused a decrease in both deflection and time to failure. Greater deflection at failure and longer time to failure were recorded for MUF board, but for the UF board the 90 per cent r.h. had a more pronounced effect in increasing deflection and decreasing the time to failure. Predictions are made on the long-term stress loadings for different humidity conditions.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF00367859
