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  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 35 (2000), S. 1917-1924 
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract An attempt was made of using a liquid phase sintered alloy, which will be a liquid phase coexisting with solid particles at the bonding temperature, as an interlayer for bonding metals. With an aim of revealing the fundamental features of this modified TLP bonding, investigated were the kinetics concerned with the isothermal solidification process and the growth of solid particles in Fe-4.5wt%P and Fe-1.16wt%B interlayers for bonding pure iron. The movement of the bond interface was linearly dependent on t 1/2 with higher slope than expected in the normal TLP bonding. The higher slope is attributed to the contribution of the solid particles distributed in the interlayer. The solid particles have shown no growth. However, when pure Fe particles are allowed to coexist with the liquid of equilibrium composition, they grows very rapidly. Discussion was made on the growth kinetics of the pure Fe particles.
    Type of Medium: Electronic Resource
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