ISSN:
1572-8838
Source:
Springer Online Journal Archives 1860-2000
Topics:
Chemistry and Pharmacology
,
Electrical Engineering, Measurement and Control Technology
Notes:
Abstract An expression for the metal distribution ratio in electroplating systems as a function of the primary current density ratioL in the formM=L [W(1−r)/(1+K)] is derived.W,r andK are three dimensionless parameters related to the current efficiency ratio, the concentration polarization and activation polarization during the metal discharge. The function [W(1−r)/1+K] is compared with 1/A, the logarithmic throwing index empirically determined by Chin. The metal distribution ratio calculated by the use of the above formula is compared with the experimentally observed values. The close agreement between the two within an accuracy of 10% proves the validity of the equation derived. The logarithmic throwing power of electroplating systems is thus confirmed on theoretical grounds.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF01058865
