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Material properties in thermal-stress analysis (1981)

Miskioglu, I. ; Gryzagorides, J. ; Burger, C. P.

Springer

Experimental mechanics 21 (1981), S. 295-301

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ISSN: 1741-2765

Source: Springer Online Journal Archives 1860-2000

Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics

Notes: Abstract With simple techniques and not too-costly laboratory equipment, the significant material properties in modeling transient thermal stresses by photothermoelasticity are evaluated. The results are presented for a room-temperature-cured epoxy, a hot-cured epoxy and a polycarbonate. The materials tested are also evaluated on their applicability to a transient-thermal-stress analysis.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1007/BF02325769

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