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  • 1
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 33 (1993), S. 70-74 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The dry friction properties of three engineering thermoplastics, ultra high-molecular-weight polyethylene (UHMWPE), polyoxymethylene (POW) and polyamide 66 (PA 66), have been investigated using a plane on plane contact. During running-in, the steady-state of the friction coincides with stable values for the surface temperature of the slider. The proper trend as well as the correct order of magnitude are observed between the measured surface temperatures and those calculated using the equation of Lancaster. The increase of the run-in friction as function of the Pv factor could be well correlated by μ(t) = μss - Pv-nexp(- 2 104 t), where μss is the steady-state value of the coefficient of friction, n is a constant depending on the material tested. A decrease of μss with increasing load for UHMWPE and POM indicates that friction is primarily the result of adhesion. However, for the PA 66, the opposite is valid, assuming that in this case the high Tg of this material may play an important role. Friction increases as the rugosity of specimen diminishes and as speed increases. Finally, the coefficient of friction could be well correlated by μ = kPmexp(βv) where k, m, and β are constants depending on roughness and type of material.
    Additional Material: 9 Ill.
    Type of Medium: Electronic Resource
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