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  • 1
    ISSN: 0272-8397
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: An investigation into the effect of isothermal aging on the development of transverse cracks in cross-ply laminates of two high temperature composite systems was performed. The composite materials investigated were BASF X5260/640-800 and DuPont Avimid K/IM6. Changes in the glass transition temperature, composite weight loss, crack density, and mode I intralaminar fracture toughness were monitored during isothermal aging in air at 177°C for up to 2232 h. The two laminate configurations used in this study include two variations of the generic cross-ply configuration [02/90n]s, in which n equals 1 and 2. The results of this investigation show that a layer of degraded material forms at the surface of the X5260/640-800 bismaleimide laminates and that the thickness of the degraded layer increases with aging time. After 744 h of aging, transverse cracks form in the surface plies and an increasing crack density evolves as aging time is increased; however, transverse cracks do not form in the inner 90° ply groups with aging during the time period investigated. The Avimid K/IM6 thermoplastic polyimide laminates, which show evidence of cracking prior to aging, do not exhibit any significant change in crack density with aging. The results of the aging experiments also show that the bismaleimide system exhibits a weight loss of 1.5% and an increase in glass transition temperature from 250°C to 300°C after 2232 h of aging at 177°C, while the thermoplastic polyimide system shows a weight loss of only 0.05% and an increase in glass transition temperature from 280 to 285°C after 2232 h. Changes in the resistance to crack formation are also seen in these materials during aging. The mode I intralaminar fracture toughness, a measure of resistance to transverse crack formation, shows a 50% decrease after aging for 2232 h for the bismaleimide system, while the behavior exhibited by the thermoplastic polyimide shows little evidence of a reduction.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
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