ISSN:
1089-7550
Source:
AIP Digital Archive
Topics:
Physics
Notes:
We present two processes for the fabrication of bondable, low-loss ohmic contacts to high-temperature superconductor thin-film devices. Contact resistances at both high and low frequencies are comparable—between 5.0×10−7 and 2.0×10−5 Ω cm2 at 77 K. We demonstrate that losses at low frequency correlate with losses up to 10 GHz. Destructive bond pull strengths for 25-μm-diam, thermosonically attached gold wire average between 5.0 and 8.0 g force, exceeding the industry standard of 3.0 g force. Preliminary results also show that contact resistance as low as 1.7×10−8 Ω cm2 are attainable with annealing. These processes satisfy a pressing need for fabrication of reliable, low-loss ohmic contacts required for the development and production of high-performance passive microwave devices based on high-Tc superconducting thin-film materials.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.352994
