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  • 1
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    MEMS Packaging Technologies and 3D Integration (2022)
    MDPI - Multidisciplinary Digital Publishing Institute
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    Publikationsdatum: 2022-06-21
    Beschreibung: This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
    Schlagwort(e): heterogeneous integration ; wafer bonding ; wafer sealing ; room-temperature bonding ; Au-Au bonding ; surface activated bonding ; Au film thickness ; surface roughness ; microelectromechanical systems (MEMS) packaging ; inkjet printing ; redistribution layers ; capacitive micromachined ultrasound transducers (CMUT) ; fan-out wafer-level packaging (FOWLP) ; adhesion ; thin film metal ; parylene ; neural probe ; scotch tape test ; FEM ; MEMS resonator ; temperature coefficient ; thermal stress ; millimeter-wave ; redundant TSV ; equivalent circuit model ; S-parameters extraction ; technology evaluation ; MEMS and IC integration ; MCDM ; fuzzy AHP ; fuzzy VIKOR ; fan-out wafer-level package ; finite element ; glass substrate ; reliability life ; packaging-on-packaging ; thermal sensors ; TMOS sensor ; finite difference time domain ; optical and electromagnetics simulations ; finite element analysis ; ultrasonic bonding ; metal direct bonding ; microsystem integration ; biocompatible packaging ; implantable ; reliability ; Finite element method (FEM) ; simulation ; multilayer reactive bonding ; integrated nanostructure-multilayer reactive system ; spontaneous self-ignition ; self-propagating exothermic reaction ; Pd/Al reactive multilayer system ; Ni/Al reactive multilayer system ; low-temperature MEMS packaging ; crack propagation ; microbump ; deflection angle ; stress intensity factor (SIF) ; polymer packaging ; neural interface ; chronic implantation ; n/a ; bic Book Industry Communication::G Reference, information & interdisciplinary subjects::GP Research & information: general ; bic Book Industry Communication::P Mathematics & science::PS Biology, life sciences
    Sprache: Englisch
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  • 2
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    Integrated Circuits and Systems for Smart Sensory Applications (2022)
    MDPI - Multidisciplinary Digital Publishing Institute
    Details
    Publikationsdatum: 2022-07-06
    Beschreibung: Connected intelligent sensing reshapes our society by empowering people with increasing new ways of mutual interactions. As integration technologies keep their scaling roadmap, the horizon of sensory applications is rapidly widening, thanks to myriad light-weight low-power or, in same cases even self-powered, smart devices with high-connectivity capabilities. CMOS integrated circuits technology is the best candidate to supply the required smartness and to pioneer these emerging sensory systems. As a result, new challenges are arising around the design of these integrated circuits and systems for sensory applications in terms of low-power edge computing, power management strategies, low-range wireless communications, integration with sensing devices. In this Special Issue recent advances in application-specific integrated circuits (ASIC) and systems for smart sensory applications in the following five emerging topics: (I) dedicated short-range communications transceivers; (II) digital smart sensors, (III) implantable neural interfaces, (IV) Power Management Strategies in wireless sensor nodes and (V) neuromorphic hardware.
    Schlagwort(e): wake-up receiver ; digital controller ; reliability ; electronic toll collection (ETC) system ; dedicated short range communication (DSRC) ; temperature compensation ; piezoresistive ; pressure sensor ; negative temperature coefficient ; ACE-Q100 ; CMOS ; epilepsy ; seizure ; multichannel neural recording ; feature extraction ; closed-loop neurostimulator ; low-power ; low-noise amplifier ; implantable medical device ; switched capacitor ; voltage converter ; wide load range ; multiphase operation ; variable frequency ; integrated circuits ; EEPROM reprogrammable fuses ; memory cells ; trimming techniques with fuses ; digital temperature sensor ; temperature sensor with digital serial interface ; asynchronous control logic ; successive approximation register (SAR) ; wireless access in vehicular environments (WAVE) ; low power consumption ; capacitive digital to analog converter (CDAC) ; CMOS neural amplifier ; AC coupling ; pseudoresistor ; nonlinear distortion ; area-efficient design ; sensor node ; power mode ; wireless sensor networks ; power management ; spiking neural network ; leaky integrate and fire ; neuromorphic ; artificial neural networks ; artificial intelligence ; image classification ; capacitance-to-digital converter ; iterative-delay-chain discharge ; CMOS capacitive sensor interface ; bic Book Industry Communication::T Technology, engineering, agriculture::TB Technology: general issues ; bic Book Industry Communication::T Technology, engineering, agriculture::TB Technology: general issues::TBX History of engineering & technology
    Sprache: Englisch
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  • 3
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    Thermal and Electro-thermal System Simulation (2021)
    MDPI - Multidisciplinary Digital Publishing Institute
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    Publikationsdatum: 2024-04-11
    Beschreibung: With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.
    Schlagwort(e): TA1-2040 ; T1-995 ; thermal interface material ; thermal aging ; modeling ; LED compact thermal models ; niobium pentoxide ; model-order reduction ; ferromagnetic cores ; LED digital twin ; Cauer RC ladder ; in-situ characterization ; electronic packages ; time domain thermoreflectance ; multi-domain compact model ; power LEDs ; DC–DC converters ; structure function ; boundary condition independent ; electric aircraft ; multi-LED ; modelling ; light emitting diodes ; thin film ; JEDEC metrics ; tool agnostic ; power losses ; switching ; dynamic thermal compact model ; thermal transient testing ; reliability ; thermal transient analysis ; thermal simulation ; non-destructive testing ; IGBT ; carbon nanotubes ; compact thermal model ; power semiconductor devices ; SPICE ; phosphor light conversion ; thermal management ; LED luminaire design ; design flow ; thermal characterization ; motor cooling ; thermal phenomena ; silicone dome ; LED ; secondary heat path ; multi-domain modelling ; heating and optical power ; transient analysis ; thermal testability ; thermal conductivity ; multiple heat source ; thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology
    Sprache: Englisch
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  • 4
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    Marine Structures (2021)
    MDPI - Multidisciplinary Digital Publishing Institute
    Details
    Publikationsdatum: 2022-01-31
    Beschreibung: Structural mechanics is an important field of engineering. The main goal of structural mechanics is to ensure that structures are safe and durable so that catastrophic situations can be prevented, which can otherwise cause loss of life, environmental pollution and financial losses. Depending on the uses of the structure and the conditions that the structure is subjected to, special treatment may be required for the analysis. Specifically, marine structures are subjected to harsh environmental conditions due to the marine environment, which can cause several different damage mechanisms including fatigue and corrosion. This book on “Marine structures” considers a wide range of areas related to marine structures and provides a compilation of numerical and experimental studies related to “Marine structures” research.
    Schlagwort(e): TC1501-1800 ; TA1-2040 ; T1-995 ; shock loads ; n/a ; jacket structures ; protective device ; tripod support structures ; soil-pile-structure interaction ; acoustic metamaterials ; semi-active ; jacket platform ; solitons ; waves ; biofouling ; seawater piping systems ; motion response ; earthquake ; low-frequency sound ; failure mechanism ; free-surface flow ; depressed bottom ; performance prediction ; acoustic band gap ; marine growth ; uncoupled analysis ; towing resistance ; viscous fluid flow ; ice-induced vibration ; superelement ; anti-collision assessment ; peridynamics ; steel ; integrated numerical model ; fairlead position ; reliability ; cross-flow ; coupled analysis ; morphology evolution ; composites ; tuned mass damper ; towing method ; wave loading ; vortex-induced vibration ; coastal protection structures ; structural control ; vortical flow ; critical mass ratio ; flexible pipe ; stochastic modeling ; offshore wind turbine ; hydrodynamics ; high pressure ; offshore integrated meteorological mast (OIMM) ; ice-resistant cone ; sediment transport ; offshore wind ; thermomechanical ; corrosion detection
    Sprache: Englisch
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  • 5
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    Personalized Nursing and Health Care (2023)
    MDPI - Multidisciplinary Digital Publishing Institute
    Details
    Publikationsdatum: 2023-05-11
    Beschreibung: There has been a rapid development in the academic literature over the last ten years on papers relating to individualization, personalization, patient-, client-, consumer- and person-centredness, with work on conceptual, instrumental, observational, and experimental levels. This Special Issue presents papers that can further establish the current state of science on these topics relating to personalized nursing and health care. We collected papers that highlight and further the knowledge base conceptually, instrumentally, observationally, and experimentally with sound theoretical and methodological underpinnings and implications for research, theory, and clinical work in the disciplines of nursing, medicine, allied health, and beyond.
    Schlagwort(e): anxiety ; life satisfaction ; life–work concerns ; melatonin ; cortisol ; biopsychosocial model ; obstetric complications ; patients’ rights ; student ; nursing ; personalized medicine ; HIV ; mobile health ; smartphone application ; symptom management ; nurse practitioners ; nursing home ; COVID-19 ; palliative care ; end-of-life ; dignified death ; older adults ; accidental falls ; fall prevention ; barriers ; patient compliance ; music therapy ; dementia ; caregiver ; RCT ; patient-centred care ; competence ; assessment ; instrument ; measurement ; validity ; reliability ; individual care ; nurses ; older diabetes patients ; physicians ; support ; Parkinson’s disease ; nursing training ; integrated care ; Parkinson nurse ; personalized care ; multidisciplinary care ; patient-centered ; arthritis ; autoimmune disease ; sociopsychological factors ; emotion ; depression ; self-identity ; qualitative study ; observational study ; dysmenorrhea ; kinesio tape ; auricular acupressure ; pain ; nursing care ; patient care planning ; quality of health care ; conditional inference trees ; education ; distance ; learning ; digital ; drawings ; Nigeria ; perinatal loss ; social networks ; stillbirth ; stillborn ; functional status ; health care ; hospitalization ; activities of daily living ; pelvic floor muscle exercises ; pelvic floor dysfunction ; qualitative research ; therapeutic exercise ; therapeutic adherence ; women’s health physiotherapy ; diabetes mellitus type 2 ; prediction model ; LogicRegression ; interpretability ; pelvic organ prolapse ; lifestyle changes ; women’s experience ; n/a ; foot ; foot self-care ; methodological review ; bic Book Industry Communication::M Medicine
    Sprache: Englisch
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  • 6
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    Feature Papers in Electronic Materials Section (2022)
    MDPI - Multidisciplinary Digital Publishing Institute
    Details
    Publikationsdatum: 2024-04-11
    Beschreibung: This book entitled "Feature Papers in Electronic Materials Section" is a collection of selected papers recently published on the journal Materials, focusing on the latest advances in electronic materials and devices in different fields (e.g., power- and high-frequency electronics, optoelectronic devices, detectors, etc.). In the first part of the book, many articles are dedicated to wide band gap semiconductors (e.g., SiC, GaN, Ga2O3, diamond), focusing on the current relevant materials and devices technology issues. The second part of the book is a miscellaneous of other electronics materials for various applications, including two-dimensional materials for optoelectronic and high-frequency devices. Finally, some recent advances in materials and flexible sensors for bioelectronics and medical applications are presented at the end of the book.
    Schlagwort(e): vertical GaN ; quasi-vertical GaN ; reliability ; trapping ; degradation ; MOS ; trench MOS ; threshold voltage ; nanomanufacturing ; high-throughput method ; material printing ; flexible bioelectronics ; nanomembrane ; hybrid integration ; GaAs ; InGaAs channel ; epitaxial lift-off ; HEMT ; van der Waals ; 3C-SiC ; stacking faults ; doping ; KOH etching ; silicon carbide ; radiation hardness ; proton and electron irradiation ; charge removal rate ; compensation ; irradiation temperature ; heteroepitaxy ; bulk growth ; compliant substrates ; defects ; stress ; cubic silicon carbide ; power electronics ; thin film ; iron-based superconductor ; pulsed laser deposition ; transmission electron microscopy ; diamond ; MPCVD growth ; electron microscopy ; chemical vapour deposition ; 2D materials ; MoS2 ; silica point defects ; optical fibers ; radiation effects ; 4H-SiC ; ohmic contact ; SIMS ; Ti3SiC2 ; simulation ; Schottky barrier ; Schottky diodes ; electrical characterization ; graphene absorption ; Fabry–Perot filter ; radio frequency sputtering ; CVD graphene ; GaN ; thermal management ; GaN-on-diamond ; CVD ; arrhythmia detection ; cardiovascular monitoring ; soft biosensors ; wearable sensors ; flexible electronics ; gate dielectric ; aluminum oxide ; interface ; traps ; instability ; insulators ; binary oxides ; high-κ dielectrics ; wide band gap semiconductors ; energy electronics ; ultra-wide bandgap ; diodes ; transistors ; gallium oxide ; Ga2O3 ; spinel ; ZnGa2O4 ; thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues ; thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology ; thema EDItEUR::K Economics, Finance, Business and Management::KN Industry and industrial studies::KNB Energy industries and utilities
    Sprache: Englisch
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  • 7
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    Achievements and Prospects of Functional Pavement (2022)
    MDPI - Multidisciplinary Digital Publishing Institute
    Details
    Publikationsdatum: 2024-04-11
    Beschreibung: In order to further promote the development of functional pavement technology, a Special Issue entitled “Achievements and Prospects of Functional Pavement” has been proposed by a group of guest editors. To achieve this objective, the articles included in this Special Issue are related to different aspects of functional pavements, including green roads to decrease carbon emissions, noise, and pollution, safety pavements to increase skid resistance through water drainage and snow removal, intelligent roads for monitoring, power generation, temperature control and management, and durable roads to increase service life with new theories, new design methods, and prediction models, as highlighted in this editorial.
    Schlagwort(e): oyster shell powder ; calcite filler ; asphalt mastics ; rutting ; fatigue cracking ; thermal stability ; glass transition temperature ; modified asphalt ; fatigue resistance ; MSCR ; intermediate temperature ; cement-treated aggregate base ; fatigue equation ; loading rates ; true stress ratio ; flexural strength ; algorithm ; aggregates ; reconstitution ; image processing ; virtual modelling ; asphalt pavements ; top-down cracking mechanism ; shear damage ; tension propagation ; rock asphalt ; creep test ; thermal crack ; viscoelastic model ; oil shale waste ; silane coupling agent ; replace fine aggregate ; response surface methodology ; central composite design ; bio-char ; asphalt ; microscopic morphology ; rheological properties ; anti-aging properties ; non-Newtonian behavior ; viscosity ; bitumen ; crumb rubber modifier (CRM) ; warm mix asphalt ; asphalt mixture ; PAN fiber ; fatigue performance ; fatigue model ; loading condition ; intermediate principle stress ; compressive strength ; true-triaxial ; asphalt mixtures ; cement stabilized macadam ; gradation ; cement content ; preparation technique ; emulsified asphalt ; nano-TiO2 ; photocatalytic coating ; degradation of exhaust gas ; road engineering ; crack resistance ; fatigue crack propagation test ; reliability ; rubber asphalt stress absorption layer (RASAL) ; high viscous asphalt sand stress absorption layer (HVASAL) ; asphalt overlay ; concrete pavement ; textural characteristics ; noise ; correlation analysis ; asphalt mortar ; ageing ; FTIR ; stiffness ; strength ; Induction heating ; pavement compaction ; porous asphalt mixes ; computational tools ; HMAC ; dynamic response ; moving load ; temperature field ; rutting resistance ; the permanent deformation ; rejuvenation ; alginate ; capsules ; diatomite ; rheological characteristics ; high temperature performance ; low temperature performance ; red clay ; additive ; resilient modulus ; prediction models ; new comprehensive prediction model ; functional pavement ; green road ; safety pavement ; intelligent road ; durable road ; pavement materials ; thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues ; thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology ; thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TR Transport technology and trades
    Sprache: Englisch
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  • 8
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    Civil and Military Airworthiness (2022)
    MDPI - Multidisciplinary Digital Publishing Institute
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    Publikationsdatum: 2022-02-01
    Beschreibung: Effective safety management has always been a key objective for the broader airworthiness sector. This book is focused on safety themes with implications on airworthiness management. It offers a diverse set of analyses on aircraft maintenance accidents, empirical and systematic investigations on important continuing airworthiness matters and research studies on methodologies for the risk and safety assessment in continuing and initial airworthiness. Overall, this collection of research and review papers is a valuable addition to the published literature, useful for the community of aviation professionals and researchers.
    Schlagwort(e): minimum equipment list ; aviation ; aircraft ; safety ; airworthiness ; flight safety ; aviation accidents ; aircraft maintenance ; MxFACS ; General Aviation ; human factors ; engineering changes ; regulation ; management changes ; industry change ; maintenance engineering culture ; Bowtie analysis ; risk assessment ; MRO ; visual inspection ; cause–consequence analysis ; barrier model ; 6M ; Ishikawa ; accidents ; maintenance ; military aviation ; airlift ; cost ; integration-in-totality principle ; seven-principles-framework of system safety ; systems thinking ; systems engineering ; system safety principles ; strategic quality management ; risk management ; reliability ; Nigerian aviation accidents ; learning form incidents ; safety management ; learning from incidents ; aviation safety ; learning taxonomy ; n/a ; bic Book Industry Communication::T Technology, engineering, agriculture::TB Technology: general issues
    Sprache: Englisch
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  • 9
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    Low-Cost Sensors and Biological Signals (2022)
    MDPI - Multidisciplinary Digital Publishing Institute
    Details
    Publikationsdatum: 2024-04-09
    Beschreibung: Many sensors are currently available at prices lower than USD 100 and cover a wide range of biological signals: motion, muscle activity, heart rate, etc. Such low-cost sensors have metrological features allowing them to be used in everyday life and clinical applications, where gold-standard material is both too expensive and time-consuming to be used. The selected papers present current applications of low-cost sensors in domains such as physiotherapy, rehabilitation, and affective technologies. The results cover various aspects of low-cost sensor technology from hardware design to software optimization.
    Schlagwort(e): inertial sensor ; gait ; validity ; functional calibration ; accuracy ; wearable electronic devices ; kinematics ; head rotation ; ecological research ; gait analysis ; characterization ; smart insole ; vertical ground reaction forces ; force sensitive resistors ; piezoelectric sensors ; sensor calibration ; heart rate ; photoplethysmography ; PPG ; time-domain ; wearable device ; concurrent validity ; outcome assessment ; feasibility ; rehabilitation ; data fusion ; MARG ; IMU ; eye tracker ; self-contained ; head motion measurement ; motor variability ; actigraphy ; triaxial accelerometers ; jumping ; human-computer interaction ; affective technologies ; interaction design ; biosensing ; actuation ; somaesthetics ; design toolkits ; serious videogames ; motion capture ; upper limbs ; physical rehabilitation ; telerehabilitation ; inertial sensors ; inertial measurement unit (IMU) ; state of the art ; inertial sensor measurement systems ; motion accuracy ; Baduanjin ; physical education ; physiotherapy ; e-health ; motion sensing ; wireless charging ; wireless connectivity ; low power ; trunk ; upper extremity ; compensation ; reaching ; Kinect ; video motion capture ; reliability ; n/a ; thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues
    Sprache: Englisch
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  • 10
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    Latest Advancements in Next-Generation Semiconductors: Materials and Devices for Wide Bandgap and 2D Semiconductors (2023)
    MDPI - Multidisciplinary Digital Publishing Institute
    Details
    Publikationsdatum: 2024-04-11
    Beschreibung: This essential collection, edited by Dr. Zeheng Wang and Dr. Jing-Kai Huang, unveils the latest advancements in semiconductor technology that are considered to be the cornerstone of the modern digital era. Spanning cutting-edge research in semiconductor materials, devices, and systems, this reprint is an indispensable guide through the innovative realms of microelectronics and nanotechnology.Dive into expert discussions on device architectures, from high-electron-mobility transistors to innovative designs resistant to extreme conditions. Explore the frontiers of material science and fabrication techniques, witnessing groundbreaking methods that enhance device performance and reliability. Uncover the evolving landscape of energy efficiency and power management, crucial for next-generation telecommunications and electric vehicles. Lastly, immerse yourself in the dynamic world of optoelectronics, where advancements in light-based technologies are redefining possibilities.Bringing together pioneering research papers, this volume is not just an academic resource but a beacon for industry professionals and scholars alike, pointing the way to the future of semiconductor technology.
    Schlagwort(e): derating ; DC–DC converter ; eGaN ; PoL ; conductive polymer tantalum chip capacitor ; reliability ; MTBF ; quartz flexible accelerometer ; electric field coupling noise ; lock-in amplifier circuit ; AlGaN/GaN ; high-electron-mobility transistor ; passivation ; HfO2 ; power clamp circuit ; ESD ; HBM ; false trigger ; bulk electron accumulation (BEA) ; extended superjunction trench gate ; extended drain (ED) ; BV and Ron,sp ; fluorides ; diamond ; ultrashort-pulse laser ; direct laser inscription ; photoluminescent microbits ; vacancy clusters ; Micro-LED ; metasurface ; light extraction efficiency ; angular deflection ; polarization ; a-IGZO ; magnetron sputtering ; thin-film transistors ; oxygen vacancy ; oxygen flow rate ; band-to-band tunneling (BTBT) ; linear energy transfer value (LET) ; single-particle irradiation effect ; anti-irradiation optimization ; GaN ; high electron mobility transistors ; nanochannel ; tri-gate ; dual-gate ; n/a ; thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues ; thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology ; thema EDItEUR::K Economics, Finance, Business and Management::KN Industry and industrial studies::KNB Energy industries and utilities
    Sprache: Englisch
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