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  • Electronics and Electrical Engineering  (783)
  • Creep observations and analysis
  • 2005-2009  (788)
  • 1
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    In:  Earth planet. Sci. Lett., Potsdam, ZIPE, vol. 238, no. 1-2, pp. 225-234, pp. 2156, (ISBN: 0-12-018847-3)
    Publication Date: 2005
    Keywords: Creep observations and analysis ; Crustal deformation (cf. Earthquake precursor: deformation or strain) ; Geodesy ; SAR ; Fault zone ; NAF ; Strike-slip ; EPSL
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  • 2
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    In:  J. Geophys. Res., Kunming, China, Inst. f. Theoret. Geodäsie, vol. 110, no. B8, pp. 771-785, pp. B08307, (ISSN: 1340-4202)
    Publication Date: 2005
    Keywords: Crustal deformation (cf. Earthquake precursor: deformation or strain) ; Friction ; Subduction zone ; Modelling ; Creep observations and analysis ; Three dimensional ; Seismicity ; JGR
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  • 3
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    In:  J. Geophys. Res., Hannover, Geophys. Institut der Universität Karlsruhe, vol. 110, no. B8, pp. 209-228, pp. B08406, (ISSN: 1340-4202)
    Publication Date: 2005
    Keywords: Crustal deformation (cf. Earthquake precursor: deformation or strain) ; Creep observations and analysis ; Fault zone ; California ; USA ; Seismicity ; Geodesy ; JGR ; Buergmann ; Burgmann
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  • 4
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    In:  J. Geophys. Res., London, Geological Society, vol. 110, no. B7, pp. 309-310, pp. B07203, (ISBN 1-86239-117-3)
    Publication Date: 2005
    Keywords: Rheology ; Mineralogy ; Rock mechanics ; Creep observations and analysis ; JGR ; creep ; two-phase ; lower ; crust ; mylonites. ; 8159 ; Tectonophysics: ; Rheology: ; crust ; and ; lithosphere ; (8031) ; 8012 ; Structural ; Geology: ; High ; strain ; deformation ; zones ; 5120 ; Physical ; Properties ; of ; Rocks: ; Plasticity, ; diffusion, ; and ; creep ; 3902 ; Mineral ; Physics: ; Creep ; and ; deformation
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  • 5
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    In:  Geophys. Res. Lett., Stockholm, 3-4, vol. 32, no. 3, pp. 245-263, pp. L03308, (ISSN: 1340-4202)
    Publication Date: 2005
    Description: We show that realistic aftershock sequences with space-time characteristics compatible with observations are generated by a model consisting of brittle fault segments separated by creeping zones. The dynamics of the brittle regions is governed by static/kinetic friction, 3D elastic stress transfer and small to moderate creep deformation compatible with laboratory experiments. The creeping parts are characterized by high ongoing creep velocities. These regions store stress during earthquake failures and then release it in the interseismic periods. The resulting postseismic deformation leads to aftershock sequences following the modified Omori law. The ratio of creep coefficients in the brittle and creeping sections determines the duration of the postseismic transients and the exponent p of the modified Omori law.
    Keywords: Aftershocks ; Omori ; Creep observations and analysis ; Friction ; Rheology ; Inhomogeneity ; Earthquake precursor: prediction research ; Seismicity ; Zoeller ; Zoller ; GRL ; 209 ; Seismology: ; Earthquake ; dynamics ; (1242) ; 7223 ; Earthquake ; interaction, ; forecasting, ; and ; prediction ; (1217, ; 1242) ; 7230 ; Seismicity ; and ; tectonics ; (1207, ; 1217, ; 1240, ; 1242) ; 7260 ; Theory ; 7290 ; Computational ; seismology
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  • 6
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    In:  Other Sources
    Publication Date: 2011-08-26
    Description: Microwave and millimeter wave imaging has shown tremendous utility in a wide variety of applications. These techniques are primarily based on measuring coherent electric field distribution on the target being imaged. Mechanically scanned systems are the simple and low cost solution in microwave imaging. However, these systems are typically bulky and slow. This dissertation presents a design for a 2D switched imaging array that utilizes modulated scattering techniques for spatial multiplexing of the signal. The system was designed to be compact, coherent, possessing high dynamic range, and capable of video frame rate imaging. Various aspects of the system design were optimized to achieve the design objectives. The 2D imaging system as designed and described in this dissertation utilized PIN diode loaded resonant elliptical slot antennas as array elements. The slot antennas allow for incorporating the switching into the antennas thus reducing the cost and size of the array. Furthermore, these slots are integrated in a simple low loss waveguide network. Moreover, the sensitivity and dynamic range of this system is improved by utilizing a custom designed heterodyne receiver and matched filter. This dissertation also presents an analysis on the properties of this system. The performance of the multiplexing scheme, the noise floor and the dynamic range of the receivers are investigated. Furthermore, sources of errors such as mutual coupling and array response dispersion are also investigated. Finally, utilizing this imaging system for various applications such as 2D electric field mapping, scatterer localization, and nondestructive imaging is demonstrated.
    Keywords: Electronics and Electrical Engineering
    Type: M09-0626
    Format: text
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  • 7
    Publication Date: 2017-10-02
    Description: Introduction: With the anticipated development of high-capacity fission power and electric propulsion for deep-space missions, it will become possible to propose experiments that demand higher power than current technologies (e.g. radioisotope power sources) provide. Jupiter Icy Moons Orbiter (JIMO), the first mission in the Project Prometheus program, will explore the icy moons of Jupiter with a suite of high-capability experiments that take advantage of the high power levels (and indirectly, the high data rates) that fission power affords. This abstract describes two high-capability active-remote-sensing experiments that will be logical candidates for subsequent Prometheus-class missions.
    Keywords: Electronics and Electrical Engineering
    Type: Lunar and Planetary Science XXXVI, Part 4; LPI-Contrib-1234-Pt-4
    Format: application/pdf
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  • 8
    Publication Date: 2018-06-11
    Description: Area array packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic ball grid array (PBGA) and chip scale package assemblies, because of their wide usage for commercial applications, have been extensively reported on in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.However, very limited data is available for thermal cycling behavior of ceramic packages commonly used for the aerospace applications. For high reliability applications, numerous AAPs are available with an identical design pattern both in ceramic and plastic packages. This paper compares assembly reliability of ceramic and plastic packages with the identical inputs/outputs(I/Os) and pattern. The ceramic package was in the form of ceramic column grid array (CCGA) with 560 I/Os peripheral array with the identical pad design as its plastic counterpart.
    Keywords: Electronics and Electrical Engineering
    Type: Transactions On Components And Packaging Technologies (ISSN 1521-3331); Volume 31; No. 2; 285-296
    Format: text
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  • 9
    Publication Date: 2018-06-11
    Description: It has been observed that power MOSFETs can experience an SEGR and continue to function with altered parameters. We propose that there are three different types of SEGR modes; the micro-break, the thermal runaway, and the avalanche breakdown. Data that demonstrates these stages of device failure are presented as well as a proposed model for the micro-break. Brief discussions of the other modes, based on analysis combined with our interpretations of the older literature, are also given.
    Keywords: Electronics and Electrical Engineering
    Type: IEEE Transactions On Nuclear Science; Volume 55; No. 4; 2366-2375
    Format: text
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  • 10
    Publication Date: 2018-06-11
    Description: High density PWB (printed wiring board) with microvia technology is required for implementation of high density and high I/O area array packages (AAP). COTS (commercial off-the-shelf) AAP packaging technologies in high reliability versions with 1.27 mm pitch are now being considered for use in a number of NASA systems including Space Shuttle and Mars Rovers. NASA functional system designs are requiring more and more dense AAP packages and board space, which makes board microvia technology very attractive for effectively routing a large number of package inputs/outputs. However, the reliability of the fine feature microvias including via in pads is unknown for space applications. Understanding process and QA (quality assurance) indicators for reliability are important for low risk insertion of these newly available packages and PWBs. This paper presents literature search as well as test results for a high density board subjected to various thermal cycle and reflow profiles representative of tin-lead and lead-free solder reflow. Microvias sizes ranged from two to six mil with and without filling. Daisy chain microvias monitored during the test and PWBs were cross-sectioned to determine failure and locations. Optical and SEM photographs as well as resistance changes during cycling and Tg/Td (glass transition/decomposition temperature) characterisations are presented.
    Keywords: Electronics and Electrical Engineering
    Type: International Journal of Materials and Structural Integrity; Volume 2; Nos. 1/2; 47-63
    Format: text
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