ISSN:
1573-0727
Keywords:
Boundary-Scan
;
Multichip Module
;
MCM
;
interconnect testing
;
manufacturing defects
;
fault diagnosis
Source:
Springer Online Journal Archives 1860-2000
Topics:
Electrical Engineering, Measurement and Control Technology
Notes:
Abstract Much has already been written concerning the IEEE 1149.1Boundary-Scan standard and its application to the detection ofmanufacturing defects [1–3]. However, when circuits such as Multichip Modules (MCMs) which are difficult and expensiveto repair are involved, much more is required of adiagnostic engine than the mere detection of a defect. The cost ofthe dice on a module make it imperative that the diagnostic procedures implemented by a tester be exact. It is not enough tojust state that “Node ‹m› isshorted to node ‹n›”, or that “Node ‹p› is stuck at1”, as is frequently the case with printed-circuit boarddiagnostics. MCM diagnostics must examine the data returned fromthe test and, as far as is possible, state not only the symptom ofthe fault, but also its exact cause and location. This articlepresents a set of formalized diagnostic rules which will, wheneverpossible, determine the symptom, cause, and location of amanufacturing defect.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1023/A:1008282800908
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