ISSN:
0032-3888
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
As a result of increased interest from industry in using dielectric cure monitoring, a need has arisen for simplifying frequency, cure, and temperature dependent data so that control decisions can be readily made. Techniques utilizing data covering several decades of frequency now exist for separating ionic conduction levels from dipole and electrode polarization responses. Ionic conduction levels are particularly useful since they can be correlated to both viscosity and extent of cure. In addition to being a function of extent of cure, dielectric properties are also influenced by temperature. This dependence often makes the dielectric response more difficult to interpret. This paper investigates two methods for overcoming the temperature dependence of the dielectric response during nonisothermal cure. The first method utilizes recent WLF modeling techniques and extends them with the end result of extracting Tg in real time during cure. The second technique involves measuring the temperature dependence of uncured and cured material. Utilizing the correlation between log ionic conductivity and extent of cure, which has been noted by previous researchers, the normalized conductivity can be converted to a cure index. Several examples including epoxy, polyurethane, and a UV cured photoresist are presented, showing data before normalization and after both Tg and cure index determination.
Additional Material:
11 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pen.760290512
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