ISSN:
1432-0630
Keywords:
82.50
;
82.65
;
79.20
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Abstract Surfaces of single-crystal silicon wafers are amorphized by high-dose phosphorous ion implantation. These surfaces of the wafers, immersed in concentrated KOH, are laser-chemically etched by pulse irradiation of a ruby laser. Simultaneously, the remaining parts of the amorphous layer are annealed. The time dependence of the etching process enhanced during pulse irradiation is recorded and analysed. Reasons for the etching rates which differ between amorphous and single-crystal silicon are given on the basis of experimental and numerical results.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF00620461
Permalink